Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | LSSOP, SSOP8,.16 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| series | AUC |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 2.95 mm |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| Maximum Frequency@Nom-Su | 200000000 Hz |
| MaximumI(ol) | 0.005 A |
| Humidity sensitivity level | 1 |
| Number of digits | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Output polarity | COMPLEMENTARY |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LSSOP |
| Encapsulate equivalent code | SSOP8,.16 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.2/2.5 V |
| Prop。Delay @ Nom-Su | 3.8 ns |
| propagation delay (tpd) | 3.8 ns |
| Certification status | Not Qualified |
| Maximum seat height | 1.3 mm |
| Maximum supply voltage (Vsup) | 2.7 V |
| Minimum supply voltage (Vsup) | 0.8 V |
| Nominal supply voltage (Vsup) | 1.2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE |
| width | 2.8 mm |
| minfmax | 275 MHz |
| SN74AUC1G74DCTRE4 | SN74AUC1G74YZPR | SN74AUC1G74DCTR | SN74AUC1G74DCUR | SN74AUC1G74DCURE4 | SN74AUC1G74RSER | SN74AUC1G74DCURG4 | SN74AUC1G74RSERG4 | SN74AUC1G74DCTRG4 | SN74AUC1G74YEPR | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-DSBGA -40 to 85 | Flip Flop D-Type Pos-Edge 1-Element 8-Pin SSOP T/R | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85 | IC FF D-TYPE SNGL 1BIT 8DSBGA |
| Brand Name | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| Is it Rohs certified? | conform to | conform to | - | conform to | conform to | conform to | conform to | conform to | conform to | incompatible |
| Maker | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments |
| Parts packaging code | SOIC | BGA | - | SOIC | TSSOP | QFN | SOIC | QFN | SOIC | BGA |
| package instruction | LSSOP, SSOP8,.16 | VFBGA, BGA8,2X4,20 | - | VSSOP-8 | VSSOP, TSSOP8,.12,20 | HVQCCN, LCC8,.06SQ,20 | VSSOP, TSSOP8,.12,20 | HVQCCN, LCC8,.06SQ,20 | LSSOP, TSSOP8,.16 | VFBGA, BGA8,2X4,20 |
| Contacts | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | - | compliant | compli | compli | compli | compli | compli | not_compliant |
| series | AUC | AUC | - | AUC | AUC | AUC | AUC | AUC | AUC | AUC |
| JESD-30 code | R-PDSO-G8 | R-XBGA-B8 | - | R-PDSO-G8 | R-PDSO-G8 | S-XQCC-N8 | R-PDSO-G8 | S-XQCC-N8 | R-PDSO-G8 | R-XBGA-B8 |
| JESD-609 code | e4 | e1 | - | e4 | e4 | e4 | e4 | e4 | e4 | - |
| length | 2.95 mm | 1.9 mm | - | 2.3 mm | 2.3 mm | 1.5 mm | 2.3 mm | 1.5 mm | 2.95 mm | 1.9 mm |
| Load capacitance (CL) | 15 pF | 15 pF | - | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Maximum Frequency@Nom-Su | 200000000 Hz | 200000000 Hz | - | - | 200000000 Hz | 200000000 Hz | 200000000 Hz | 200000000 Hz | 200000000 Hz | - |
| MaximumI(ol) | 0.005 A | 0.009 A | - | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.005 A | 0.005 A | 0.005 A |
| Humidity sensitivity level | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
| Number of digits | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| encapsulated code | LSSOP | VFBGA | - | VSSOP | VSSOP | HVQCCN | VSSOP | HVQCCN | LSSOP | VFBGA |
| Encapsulate equivalent code | SSOP8,.16 | BGA8,2X4,20 | - | TSSOP8,.12,20 | TSSOP8,.12,20 | LCC8,.06SQ,20 | TSSOP8,.12,20 | LCC8,.06SQ,20 | TSSOP8,.16 | BGA8,2X4,20 |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing | TAPE AND REEL | TR | - | TR | TR | TR | TR | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| power supply | 1.2/2.5 V | 1.2/2.5 V | - | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V |
| Prop。Delay @ Nom-Su | 3.8 ns | 3.8 ns | - | - | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | - |
| propagation delay (tpd) | 3.8 ns | 3.8 ns | - | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.3 mm | 0.5 mm | - | 0.9 mm | 0.9 mm | 0.6 mm | 0.9 mm | 0.6 mm | 1.3 mm | 0.5 mm |
| Maximum supply voltage (Vsup) | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Minimum supply voltage (Vsup) | 0.8 V | 0.8 V | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| Nominal supply voltage (Vsup) | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| surface mount | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| Terminal form | GULL WING | BALL | - | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | BALL |
| Terminal pitch | 0.65 mm | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
| Terminal location | DUAL | BOTTOM | - | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| width | 2.8 mm | 0.9 mm | - | 2 mm | 2 mm | 1.5 mm | 2 mm | 1.5 mm | 2.8 mm | 0.9 mm |
| minfmax | 275 MHz | 275 MHz | - | 275 MHz | 275 MHz | 275 MHz | 275 MHz | 275 MHz | 275 MHz | 275 MHz |
stm32/stm8
Embedded System
Electronics Design Contest
DIY/Open Source Hardware
Download Centre
Power technology
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
