|
SN74AUC1G74YEPR |
SN74AUC1G74YZPR |
SN74AUC1G74DCTR |
SN74AUC1G74DCUR |
SN74AUC1G74DCTRE4 |
SN74AUC1G74DCURE4 |
SN74AUC1G74RSER |
SN74AUC1G74DCURG4 |
SN74AUC1G74RSERG4 |
SN74AUC1G74DCTRG4 |
Description |
IC FF D-TYPE SNGL 1BIT 8DSBGA |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-DSBGA -40 to 85 |
Flip Flop D-Type Pos-Edge 1-Element 8-Pin SSOP T/R |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85 |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85 |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85 |
Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85 |
Is it Rohs certified? |
incompatible |
conform to |
- |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Parts packaging code |
BGA |
BGA |
- |
SOIC |
SOIC |
TSSOP |
QFN |
SOIC |
QFN |
SOIC |
package instruction |
VFBGA, BGA8,2X4,20 |
VFBGA, BGA8,2X4,20 |
- |
VSSOP-8 |
LSSOP, SSOP8,.16 |
VSSOP, TSSOP8,.12,20 |
HVQCCN, LCC8,.06SQ,20 |
VSSOP, TSSOP8,.12,20 |
HVQCCN, LCC8,.06SQ,20 |
LSSOP, TSSOP8,.16 |
Contacts |
8 |
8 |
- |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
not_compliant |
compli |
- |
compliant |
compli |
compli |
compli |
compli |
compli |
compli |
series |
AUC |
AUC |
- |
AUC |
AUC |
AUC |
AUC |
AUC |
AUC |
AUC |
JESD-30 code |
R-XBGA-B8 |
R-XBGA-B8 |
- |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
S-XQCC-N8 |
R-PDSO-G8 |
S-XQCC-N8 |
R-PDSO-G8 |
length |
1.9 mm |
1.9 mm |
- |
2.3 mm |
2.95 mm |
2.3 mm |
1.5 mm |
2.3 mm |
1.5 mm |
2.95 mm |
Load capacitance (CL) |
15 pF |
15 pF |
- |
15 pF |
15 pF |
15 pF |
15 pF |
15 pF |
15 pF |
15 pF |
Logic integrated circuit type |
D FLIP-FLOP |
D FLIP-FLOP |
- |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
MaximumI(ol) |
0.005 A |
0.009 A |
- |
0.009 A |
0.005 A |
0.009 A |
0.009 A |
0.009 A |
0.005 A |
0.005 A |
Number of digits |
1 |
1 |
- |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
- |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
- |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
- |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
- |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
COMPLEMENTARY |
COMPLEMENTARY |
- |
COMPLEMENTARY |
COMPLEMENTARY |
COMPLEMENTARY |
COMPLEMENTARY |
COMPLEMENTARY |
COMPLEMENTARY |
COMPLEMENTARY |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
encapsulated code |
VFBGA |
VFBGA |
- |
VSSOP |
LSSOP |
VSSOP |
HVQCCN |
VSSOP |
HVQCCN |
LSSOP |
Encapsulate equivalent code |
BGA8,2X4,20 |
BGA8,2X4,20 |
- |
TSSOP8,.12,20 |
SSOP8,.16 |
TSSOP8,.12,20 |
LCC8,.06SQ,20 |
TSSOP8,.12,20 |
LCC8,.06SQ,20 |
TSSOP8,.16 |
Package shape |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
- |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
method of packing |
TAPE AND REEL |
TR |
- |
TR |
TAPE AND REEL |
TR |
TR |
TR |
TAPE AND REEL |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
- |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
power supply |
1.2/2.5 V |
1.2/2.5 V |
- |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
propagation delay (tpd) |
3.8 ns |
3.8 ns |
- |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
Certification status |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.5 mm |
0.5 mm |
- |
0.9 mm |
1.3 mm |
0.9 mm |
0.6 mm |
0.9 mm |
0.6 mm |
1.3 mm |
Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
- |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
- |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
- |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
- |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
- |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
- |
0.5 mm |
0.65 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.65 mm |
Terminal location |
BOTTOM |
BOTTOM |
- |
DUAL |
DUAL |
DUAL |
QUAD |
DUAL |
QUAD |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Trigger type |
POSITIVE EDGE |
POSITIVE EDGE |
- |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
width |
0.9 mm |
0.9 mm |
- |
2 mm |
2.8 mm |
2 mm |
1.5 mm |
2 mm |
1.5 mm |
2.8 mm |
minfmax |
275 MHz |
275 MHz |
- |
275 MHz |
275 MHz |
275 MHz |
275 MHz |
275 MHz |
275 MHz |
275 MHz |
Brand Name |
- |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
JESD-609 code |
- |
e1 |
- |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
Maximum Frequency@Nom-Su |
- |
200000000 Hz |
- |
- |
200000000 Hz |
200000000 Hz |
200000000 Hz |
200000000 Hz |
200000000 Hz |
200000000 Hz |
Humidity sensitivity level |
- |
1 |
- |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Prop。Delay @ Nom-Su |
- |
3.8 ns |
- |
- |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
3.8 ns |
Terminal surface |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |