EC3125B10-27.000M
EC31 25
Series
RoHS Compliant (Pb-free) 5.0V 14 Pin DIP Metal
Thru-Hole HCMOS/TTL VCXO
Frequency Tolerance/Stability
±25ppm Maximum
Package
Duty Cycle
50 ±10(%)
RoHS
Pb
Nominal Frequency
27.000MHz
B 10
-27.000M
Operating Temperature Range
0°C to +70°C
Linearity
±10% Maximum
Frequency Deviation
±150ppm Minimum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
27.000MHz
±25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
±5ppm/year Maximum
0°C to +70°C
5.0Vdc ±5%
40mA Maximum
2.4Vdc Minimum with TTL Load, Vdd-0.5Vdc with HCMOS Load
0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load
5nSec Maximum (0.4Vdc to 2.4Vdc w/TTL Load, 20% to 80% of waveform w/HCMOS Load)
50 ±10(%) (Measured at 1.4Vdc with TTL Load or at 50% of waveform with HCMOS Load)
10TTL Load or 15pF HCMOS Load Maximum
CMOS
2.5Vdc ±2.0Vdc
±150ppm Minimum
±10% Maximum
Positive Transfer Characteristic
±100pSec Maximum
±25pSec Maximum
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Control Voltage
Frequency Deviation
Linearity
Transfer Function
Absolute Clock Jitter
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 1 of 7
EC3125B10-27.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
15.240
±0.203
7.620
±0.203
1
14
7
8
5.08 MIN
5.08 MAX
13.2
MAX
MARKING
ORIENTATION
DIA 0.457
±0.100 (X4)
PIN
CONNECTION
Control Voltage
Ground/Case Ground
Output
Supply Voltage
0.9 MAX
1
7
8
14
LINE MARKING
1
2
3
4
ECLIPTEK
EC31
EC31=Product Series
27.000M
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
20.8 MAX
OUTPUT WAVEFORM
CLOCK OUTPUT
V
OH
80% or 2.4V
DC
50% or 1.4V
DC
20% or 0.4V
DC
V
OL
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 2 of 7
EC3125B10-27.000M
Test Circuit for TTL Output
Output Load
Drive Capability
10TTL
5TTL
2TTL
10LSTTL
1TTL
R
L
Value
(Ohms)
390
780
1100
2000
2200
C
L
Value
(pF)
15
15
6
15
3
Supply
Voltage
(V
DD
)
Oscilloscope
Frequency
Counter
Table 1: R
L
Resistance Value and C
L
Capacitance
Value Vs. Output Load Drive Capability
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Probe
(Note 2)
Output
R
L
(Note 4)
Ground
Voltage
Control
C
L
(Note 3)
Note 5
Power
Supply
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
Note 4: Resistance value R
L
is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 3 of 7
EC3125B10-27.000M
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
Current
Meter
Power
Supply
Voltage
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
Ground
Voltage
Control
C
L
(Note 3)
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 4 of 7
EC3125B10-27.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 5 of 7
Microcontroller MCU
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