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DS33R41

Description
DATACOM, FRAMER, PBGA400, 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-400
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,336 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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DS33R41 Overview

DATACOM, FRAMER, PBGA400, 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-400

DS33R41 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeBGA
package instructionBGA,
Contacts400
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B400
length27 mm
Humidity sensitivity level3
Number of functions1
Number of terminals400
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height2.54 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceNOT SPECIFIED
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width27 mm
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