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HN27C256AFP-15T

Description
32KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOP-28
Categorystorage    storage   
File Size75KB,16 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HN27C256AFP-15T Overview

32KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOP-28

HN27C256AFP-15T Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instructionSOP,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
JESD-30 codeR-PDSO-G28
length18 mm
memory density262144 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width8.4 mm

HN27C256AFP-15T Related Products

HN27C256AFP-15T HN27C256AP-15 HN27C256AP-12 HN27C256AFP-12T
Description 32KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOP-28 32KX8 OTPROM, 150ns, PDIP28, PLASTIC, DIP-28 32K X 8 OTPROM, 120 ns, PDIP28, PLASTIC, DIP-28 32KX8 OTPROM, 120ns, PDSO28, PLASTIC, SOP-28
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code SOIC DIP DIP SOIC
package instruction SOP, DIP, DIP, SOP,
Contacts 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 150 ns 150 ns 120 ns 120 ns
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PDSO-G28
length 18 mm 35.6 mm 35.6 mm 18 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 32KX8 32KX8 32KX8 32KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP DIP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3 mm 5.7 mm 5.7 mm 3 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO NO YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
width 8.4 mm 15.24 mm 15.24 mm 8.4 mm

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