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HN27C256AP-12

Description
32K X 8 OTPROM, 120 ns, PDIP28, PLASTIC, DIP-28
Categorystorage    storage   
File Size75KB,16 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HN27C256AP-12 Overview

32K X 8 OTPROM, 120 ns, PDIP28, PLASTIC, DIP-28

HN27C256AP-12 Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
JESD-30 codeR-PDIP-T28
length35.6 mm
memory density262144 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.7 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm

HN27C256AP-12 Related Products

HN27C256AP-12 HN27C256AP-15 HN27C256AFP-15T HN27C256AFP-12T
Description 32K X 8 OTPROM, 120 ns, PDIP28, PLASTIC, DIP-28 32KX8 OTPROM, 150ns, PDIP28, PLASTIC, DIP-28 32KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOP-28 32KX8 OTPROM, 120ns, PDSO28, PLASTIC, SOP-28
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIP DIP SOIC SOIC
package instruction DIP, DIP, SOP, SOP,
Contacts 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 150 ns 150 ns 120 ns
JESD-30 code R-PDIP-T28 R-PDIP-T28 R-PDSO-G28 R-PDSO-G28
length 35.6 mm 35.6 mm 18 mm 18 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 32KX8 32KX8 32KX8 32KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.7 mm 5.7 mm 3 mm 3 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
width 15.24 mm 15.24 mm 8.4 mm 8.4 mm
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