32K X 8 OTPROM, 120 ns, PDIP28, PLASTIC, DIP-28
Parameter Name | Attribute value |
Maker | Renesas Electronics Corporation |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 120 ns |
JESD-30 code | R-PDIP-T28 |
length | 35.6 mm |
memory density | 262144 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 5.7 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
HN27C256AP-12 | HN27C256AP-15 | HN27C256AFP-15T | HN27C256AFP-12T | |
---|---|---|---|---|
Description | 32K X 8 OTPROM, 120 ns, PDIP28, PLASTIC, DIP-28 | 32KX8 OTPROM, 150ns, PDIP28, PLASTIC, DIP-28 | 32KX8 OTPROM, 150ns, PDSO28, PLASTIC, SOP-28 | 32KX8 OTPROM, 120ns, PDSO28, PLASTIC, SOP-28 |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Parts packaging code | DIP | DIP | SOIC | SOIC |
package instruction | DIP, | DIP, | SOP, | SOP, |
Contacts | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 120 ns | 150 ns | 150 ns | 120 ns |
JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 |
length | 35.6 mm | 35.6 mm | 18 mm | 18 mm |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 |
word count | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.7 mm | 5.7 mm | 3 mm | 3 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 8.4 mm | 8.4 mm |