OT PLD, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
Parameter Name | Attribute value |
Maker | Atmel (Microchip) |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Other features | 20 FLIP FLOPS |
JESD-30 code | R-PDIP-T24 |
length | 32 mm |
Dedicated input times | 12 |
Number of I/O lines | 10 |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 12 DEDICATED INPUTS, 10 I/O |
Output function | REGISTERED |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Programmable logic type | OT PLD |
propagation delay | 25 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 3 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
ATV750LV-25PM | ATV750LVL-25SC | ATV750LVL-25SM | ATV750LV-25PC | |
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Description | OT PLD, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | OT PLD, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | OT PLD, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | OT PLD, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
Parts packaging code | DIP | SOIC | SOIC | DIP |
package instruction | DIP, | SOP, | SOP, | DIP, |
Contacts | 24 | 28 | 28 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Other features | 20 FLIP FLOPS | 20 FLIP FLOPS | 20 FLIP FLOPS | 20 FLIP FLOPS |
JESD-30 code | R-PDIP-T24 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T24 |
length | 32 mm | 17.9 mm | 17.9 mm | 32 mm |
Dedicated input times | 12 | 12 | 12 | 12 |
Number of I/O lines | 10 | 10 | 10 | 10 |
Number of terminals | 24 | 28 | 28 | 24 |
Maximum operating temperature | 125 °C | 70 °C | 125 °C | 70 °C |
organize | 12 DEDICATED INPUTS, 10 I/O | 12 DEDICATED INPUTS, 10 I/O | 12 DEDICATED INPUTS, 10 I/O | 12 DEDICATED INPUTS, 10 I/O |
Output function | REGISTERED | REGISTERED | REGISTERED | REGISTERED |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Programmable logic type | OT PLD | OT PLD | OT PLD | OT PLD |
propagation delay | 25 ns | 25 ns | 25 ns | 25 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 2.65 mm | 2.65 mm | 5.08 mm |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 3 V | 3 V | 3 V | 3 V |
surface mount | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm |