7027S25GGI8 datasheet, PDF - EEWORLD Datasheet

7027S25GGI8: DescriptionDual-Port SRAM, 32KX16, 25ns, CMOS, CPGA108, 1.210 X 1.210 INCH, 0.160 INCH HEIGHT, GREEN, CERAMIC, PGA-108; Categorystorage storage; File Size684KB，20 Pages; ManufacturerIDT (Integrated Device Technology)

Download Datasheet Parametric View All

7027S25GGI8 Overview

Dual-Port SRAM, 32KX16, 25ns, CMOS, CPGA108, 1.210 X 1.210 INCH, 0.160 INCH HEIGHT, GREEN, CERAMIC, PGA-108

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
package instruction	PGA,
Reach Compliance Code	compliant
Maximum access time	25 ns
JESD-30 code	S-CPGA-P108
memory density	524288 bit
Memory IC Type	DUAL-PORT SRAM
memory width	16
Number of functions	1
Number of terminals	108
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX16
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	PIN/PEG
Terminal location	PERPENDICULAR
Base Number Matches	1

【XMC4800 Relax EtherCAT Kit Review】+ Getting Started with DAVE, WINUSB APP Application Experience: [i=s] This post was last edited by flyword on 2019-2-12 22:42 [/i] [align=left][color=rgb(0, 0, 0)][font=Calibri, sans-serif][size=10.5pt] [/size][/font][/color][/align][align=left][color=rgb(0, 0, 0)...; flyword Industrial Control Electronics

Optimizing power management in next-generation mobile phones: Consumers expect advanced 2.5G and 3G mobile phones to have the same form factor and battery life as existing 2G phones. 2.5G and 3G "smart" phones will also offer voice, data and multimedia features,...; zbz0529 Power technology

Imagine: When the college entrance examination meets 5G, what kind of magical experience will it bring us? (Give away chip coins): The annual college entrance examination is coming. In the past, candidates often encounter traffic jams, lateness, forgetting things, etc. As the latest powerful communication means, what role can 5G ...; EEWORLD社区 RF/Wirelessly

I promised not to cry until the current "burned" the vias red...: Original article by Mr. Gaosu | Jiang JieThe current that doesn’t follow the usual path is a “thorn” in PCB design. Sometimes, even though the road to the sun is paved for it, it insists on taking the...; yvonneGan PCB Design

DSP28335 SCI communication problem summary and problem summary: [size=4]I just started learning DSP, and like many other people, I started from routines. [/size] [size=4] It is inevitable to encounter some problems in the learning process. I hope to write these pr...; Jacktang Microcontroller MCU

GSM mobile phone radio frequency system: The article first introduces the functions of the RF part of the GSM mobile phone, starting from the most primitive secondary analog frequency conversion, to the current zero intermediate frequency me...; JasonYoo RF/Wirelessly

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components