SRAM Module, 512KX8, 70ns, CMOS
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | , SIP36 |
| Reach Compliance Code | not_compliant |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of terminals | 36 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIP36 |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.008 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 7MP4058L70S | 7MP4058L85SSCD4602 | 7MP4058L85S | 7MP4058L120SSCD4602 | 7MP4058L120S | 7MP4058L70SSCD4602 | |
|---|---|---|---|---|---|---|
| Description | SRAM Module, 512KX8, 70ns, CMOS | SRAM Module, 512KX8, 85ns, CMOS | SRAM Module, 512KX8, 85ns, CMOS | SRAM Module, 512KX8, 120ns, CMOS | SRAM Module, 512KX8, 120ns, CMOS | SRAM Module, 512KX8, 70ns, CMOS |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Maximum access time | 70 ns | 85 ns | 85 ns | 120 ns | 120 ns | 70 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 36 | 36 | 36 | 36 | 36 | 36 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIP36 | SIP36 | SIP36 | SIP36 | SIP36 | SIP36 |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | 260 | 225 | 260 | 225 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.008 A | 0.00004 A | 0.008 A | 0.00004 A | 0.008 A | 0.00004 A |
| Minimum standby current | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V | 2 V |
| Maximum slew rate | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | 30 | 6 | 30 | 6 | 30 | 6 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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