EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96
Parameter Name | Attribute value |
Maker | Maxwell Technologies Inc. |
Parts packaging code | QFP |
package instruction | QFF, TPAK96,3SQ |
Contacts | 96 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Maximum access time | 200 ns |
Data polling | YES |
JESD-30 code | S-XQFP-F96 |
length | 43.3578 mm |
memory density | 8388608 bit |
Memory IC Type | EEPROM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 96 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 256KX32 |
Package body material | UNSPECIFIED |
encapsulated code | QFF |
Encapsulate equivalent code | TPAK96,3SQ |
Package shape | SQUARE |
Package form | FLATPACK |
page size | 128 words |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 6.223 mm |
Maximum standby current | 0.00008 A |
Maximum slew rate | 0.225 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
switch bit | NO |
total dose | 100k Rad(Si) V |
width | 43.3578 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | HARDWARE/SOFTWARE |
Base Number Matches | 1 |
79C0832XPQI-20 | 79C0832XPQE-15 | 79C0832XPQE-20 | 79C0832XPQH-15 | 79C0832XPQH-20 | 79C0832XPQI-15 | 79C0832XPQK-15 | 79C0832XPQK-20 | |
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Description | EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 150ns, Parallel, CMOS, QFP-96 | EEPROM Module, 256KX32, 200ns, Parallel, CMOS, QFP-96 |
Maker | Maxwell Technologies Inc. | Maxwell Technologies Inc. | Maxwell Technologies Inc. | Maxwell Technologies Inc. | Maxwell Technologies Inc. | Maxwell Technologies Inc. | Maxwell Technologies Inc. | Maxwell Technologies Inc. |
Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
package instruction | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ | QFF, TPAK96,3SQ |
Contacts | 96 | 96 | 96 | 96 | 96 | 96 | 96 | 96 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
Maximum access time | 200 ns | 150 ns | 200 ns | 150 ns | 200 ns | 150 ns | 150 ns | 200 ns |
Data polling | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 code | S-XQFP-F96 | S-XQFP-F96 | S-XQFP-F96 | S-XQFP-F96 | S-XQFP-F96 | S-XQFP-F96 | S-XQFP-F96 | S-XQFP-F96 |
length | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm |
memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 96 | 96 | 96 | 96 | 96 | 96 | 96 | 96 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
organize | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | QFF | QFF | QFF | QFF | QFF | QFF | QFF | QFF |
Encapsulate equivalent code | TPAK96,3SQ | TPAK96,3SQ | TPAK96,3SQ | TPAK96,3SQ | TPAK96,3SQ | TPAK96,3SQ | TPAK96,3SQ | TPAK96,3SQ |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
page size | 128 words | 512 words | 512 words | 128 words | 128 words | 128 words | 128 words | 128 words |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ready/busy | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum seat height | 6.223 mm | 6.223 mm | 6.223 mm | 6.223 mm | 6.223 mm | 6.223 mm | 6.223 mm | 6.223 mm |
Maximum standby current | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A |
Maximum slew rate | 0.225 mA | 0.225 mA | 0.225 mA | 0.225 mA | 0.225 mA | 0.225 mA | 0.225 mA | 0.225 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
switch bit | NO | NO | NO | NO | NO | NO | NO | NO |
width | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm | 43.3578 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
total dose | 100k Rad(Si) V | - | - | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
write protect | HARDWARE/SOFTWARE | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |