D82284B datasheet, PDF - EEWORLD Datasheet

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D82284B: DescriptionClock Generator, CMOS, CDIP18; CategoryThe embedded processor and controller Microcontrollers and processors; File Size346KB，12 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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D82284B Overview

Clock Generator, CMOS, CDIP18

D82284B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP18,.3
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-XDIP-T18
JESD-609 code	e0
Number of terminals	18
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum slew rate	145 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

D82284B Related Products

	D82284B	N82284-10	D82284	D82284-10	D82284-10B	P82284	AM82284XC
Description	Clock Generator, CMOS, CDIP18	Clock Generator, CMOS, PQCC20	Clock Generator, CMOS, CDIP18	Processor Specific Clock Generator, CMOS, CDIP18	Clock Generator, CMOS, CDIP18	Clock Generator, CMOS, PDIP18	Clock Generator, CMOS
package instruction	DIP, DIP18,.3	QCCJ, LDCC20,.4SQ	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	, DIE OR CHIP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Encapsulate equivalent code	DIP18,.3	LDCC20,.4SQ	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIE OR CHIP
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Maximum slew rate	145 mA	145 mA	145 mA	145 mA	145 mA	145 mA	145 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-
JESD-30 code	R-XDIP-T18	S-PQCC-J20	R-XDIP-T18	R-XDIP-T18	R-XDIP-T18	R-PDIP-T18	-
JESD-609 code	e0	e0	e0	e0	e0	e0	-
Number of terminals	18	20	18	18	18	18	-
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	-
encapsulated code	DIP	QCCJ	DIP	DIP	DIP	DIP	-
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	-
surface mount	NO	YES	NO	NO	NO	NO	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	-
Base Number Matches	1	1	1	1	1	-	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified

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