Processor Specific Clock Generator, CMOS, CDIP18
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP18,.3 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
JESD-30 code | R-XDIP-T18 |
JESD-609 code | e0 |
Number of terminals | 18 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 145 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
uPs/uCs/peripheral integrated circuit type | CLOCK GENERATOR, PROCESSOR SPECIFIC |
Base Number Matches | 1 |
D82284-10 | N82284-10 | D82284 | D82284-10B | D82284B | P82284 | AM82284XC | |
---|---|---|---|---|---|---|---|
Description | Processor Specific Clock Generator, CMOS, CDIP18 | Clock Generator, CMOS, PQCC20 | Clock Generator, CMOS, CDIP18 | Clock Generator, CMOS, CDIP18 | Clock Generator, CMOS, CDIP18 | Clock Generator, CMOS, PDIP18 | Clock Generator, CMOS |
package instruction | DIP, DIP18,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | , DIE OR CHIP |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Encapsulate equivalent code | DIP18,.3 | LDCC20,.4SQ | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIE OR CHIP |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum slew rate | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA | 145 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
JESD-30 code | R-XDIP-T18 | S-PQCC-J20 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-PDIP-T18 | - |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | - |
Number of terminals | 18 | 20 | 18 | 18 | 18 | 18 | - |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | - |
encapsulated code | DIP | QCCJ | DIP | DIP | DIP | DIP | - |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
surface mount | NO | YES | NO | NO | NO | NO | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |