CYDD36S36V18-167BBI datasheet, PDF

CYDD36S36V18-167BBI: DescriptionDual-Port SRAM, 1MX36, 11ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484; Categorystorage storage; File Size953KB，48 Pages; ManufacturerCypress Semiconductor

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CYDD36S36V18-167BBI Overview

Dual-Port SRAM, 1MX36, 11ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
Contacts	484
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	11 ns
Other features	PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
JESD-30 code	S-PBGA-B484
JESD-609 code	e0
length	23 mm
memory density	37748736 bit
Memory IC Type	DUAL-PORT SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	484
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX36
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
Certification status	Not Qualified
Maximum seat height	2.16 mm
Maximum supply voltage (Vsup)	1.58 V
Minimum supply voltage (Vsup)	1.42 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	23 mm
Base Number Matches	1

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