C1608C0G2A221KT datasheet, PDF

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C1608C0G2A221KT: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00022uF, Surface Mount, 0603, CHIP, ROHS AND REACH COMPLIANT; CategoryPassive components capacitor; File Size279KB，2 Pages; ManufacturerTDK Corporation; Websitehttp://www.tdk.com; Environmental Compliance

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C1608C0G2A221KT Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00022uF, Surface Mount, 0603, CHIP, ROHS AND REACH COMPLIANT

C1608C0G2A221KT Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	, 0603
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.00022 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.8 mm
JESD-609 code	e3
length	1.6 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR
positive tolerance	10%
Rated (DC) voltage (URdc)	100 V
size code	0603
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	0.8 mm
Base Number Matches	1

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C SERIES |

Conductive Epoxy

TDK’s Conductive Epoxy Series is a conductive glue-mounted device

rather than solder-mounted.

In high-temperature environments, the

connectivity reliability is focused on the solder fillet because there are thermal

expansion coefficient differences between the substrate, MLCC, and solder

fillet. A conductive glue-mounted device allows for more “flexibility” during

periods of expansion and contraction because the thermal expansion

differences have been reduced by using a non-solder attachment.

Conductive glue is a common method of mounting components in

applications that demand reliability at high temperatures, particularly in

automotive environments. It's also used in applications that cannot be

subjected to the heat of the solder paste mounting process, such as LCD

panels, organic EL and LED displays, and CCD devices, which are particularly

sensitive to high temperatures.

Body Length

Body Width

Body Height

Terminal Width

Case Code

C1005/0402

C1608/0603

C2012/0805

C3216/1206

C3225/1210

L (mm)

1.00

1.60

2.00

3.20

W (mm)

0.50

0.80

1.25

1.60

2.50

T (mm)

0.50

0.80

1.25

1.60

2.50

Part Number Description

TEMPERATURE CHARACTERISTICS

RATED VOLTAGE (DC)

PACKAGING STYLE

INTERNAL CODES

C3216

X7R

106

½½½B

SERIES NAME & DIMENSION CODE

CAPACITANCE TOLERANCE

NOMINAL CAPACITANCE (pF)

Features:



AgPdCu termination for conductive glue mounting

Reduce risk of silver migration

Improved mechanical/thermal strength when use with conductive glue

AEC Q-200 compliant

RoHS, WEE, and REACH compliant

Standard Termination

AgPdCu Termination

Applications:



Transmission control

Engine sensor module

Automotive power train

Anti-Lock Breaking System

Application requiring conductive glue mounting method

No.

(1)

(2)

(3)

(4)

(5)

NAME

Ceramic Dielectric

Internal Electrode

Termination

MATERIAL

Class 1

Class 2

CaZrO

BaTiO

Nickel (Ni)

Copper (Cu)

Nickel (Ni)

Tin (Sn)

No.

(1)

(2)

(3)

(4)

NAME

Ceramic Dielectric

Internal Electrode

Termination

MATERIAL

Class 1

Class 2

CaZrO

BaTiO

Nickel (Ni)

Copper (Cu)

AgPdCu

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