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MAX3785UTT

Description
6.25Gbps, 1.8V PC Board Equalizer
CategoryWireless rf/communication    Telecom circuit   
File Size351KB,8 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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MAX3785UTT Overview

6.25Gbps, 1.8V PC Board Equalizer

MAX3785UTT Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeDFN
package instructionTDFN-6
Contacts6
Reach Compliance Code_compli
Factory Lead Time1 week
JESD-30 codeS-PDSO-N6
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals6
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC6,.11,37
Package shapeSQUARE
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)245
power supply1.8 V
Certification statusNot Qualified
Maximum seat height0.8 mm
Maximum slew rate0.055 mA
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesLINE EQUALIZER
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formNO LEAD
Terminal pitch0.95 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3 mm

MAX3785UTT Related Products

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Description 6.25Gbps, 1.8V PC Board Equalizer Chip Multilayer Ceramic Capacitors for General Purpose 6.25Gbps, 1.8V PC Board Equalizer 6.25Gbps, 1.8V PC Board Equalizer 6.25Gbps, 1.8V PC Board Equalizer 6.25Gbps, 1.8V PC Board Equalizer 6.25Gbps, 1.8V PC Board Equalizer
Is it lead-free? Contains lead - - Lead free - Contains lead Lead free
Is it Rohs certified? incompatible - - conform to - incompatible conform to
Parts packaging code DFN - - BGA - DFN DFN
package instruction TDFN-6 - - VFBGA, BGA9,3X3,20 - TDFN-6 HVSON, SOLCC6,.11,37
Contacts 6 - - 6 - 6 6
Reach Compliance Code _compli - - unknow - _compli compli
JESD-30 code S-PDSO-N6 - - S-PBGA-B6 - S-PDSO-N6 S-PDSO-N6
length 3 mm - - 1.52 mm - 3 mm 3 mm
Number of functions 1 - - 1 - 1 1
Number of terminals 6 - - 6 - 6 6
Maximum operating temperature 85 °C - - 85 °C - 85 °C 85 °C
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON - - VFBGA - HVSON HVSON
Encapsulate equivalent code SOLCC6,.11,37 - - BGA9,3X3,20 - SOLCC6,.11,37 SOLCC6,.11,37
Package shape SQUARE - - SQUARE - SQUARE SQUARE
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - - GRID ARRAY, VERY THIN PROFILE, FINE PITCH - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 245 - - NOT SPECIFIED - 245 260
power supply 1.8 V - - 1.8 V - 1.8 V 1.8 V
Certification status Not Qualified - - Not Qualified - Not Qualified Not Qualified
Maximum seat height 0.8 mm - - 0.67 mm - 0.8 mm 0.8 mm
Maximum slew rate 0.055 mA - - 0.055 mA - 0.055 mA 0.055 mA
Nominal supply voltage 1.8 V - - 1.8 V - 1.8 V 1.8 V
surface mount YES - - YES - YES YES
Telecom integrated circuit types LINE EQUALIZER - - LINE EQUALIZER - LINE EQUALIZER LINE EQUALIZER
Temperature level OTHER - - OTHER - OTHER OTHER
Terminal form NO LEAD - - BALL - NO LEAD NO LEAD
Terminal pitch 0.95 mm - - 0.5 mm - 0.95 mm 0.95 mm
Terminal location DUAL - - BOTTOM - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 3 mm - - 1.52 mm - 3 mm 3 mm
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