MAX3785ITT datasheet, PDF - EEWORLD Datasheet

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MAX3785ITT: Description6.25Gbps, 1.8V PC Board Equalizer; CategoryWireless rf/communication Telecom circuit; File Size351KB，8 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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MAX3785ITT Overview

6.25Gbps, 1.8V PC Board Equalizer

MAX3785ITT Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DFN
package instruction	TDFN-6
Contacts	6
Reach Compliance Code	_compli
JESD-30 code	S-PDSO-N6
JESD-609 code	e0
length	3 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC6,.11,37
Package shape	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	245
power supply	1.8 V
Certification status	Not Qualified
Maximum seat height	0.8 mm
Maximum slew rate	0.055 mA
Nominal supply voltage	1.8 V
surface mount	YES
Telecom integrated circuit types	LINE EQUALIZER
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	NO LEAD
Terminal pitch	0.95 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Base Number Matches	1

MAX3785ITT Related Products

	MAX3785ITT	GRM1555C2A8R2DA01J	MAX3785	MAX3785UWL+	MAX3785_08	MAX3785UTT	MAX3785UTT+
Description	6.25Gbps, 1.8V PC Board Equalizer	Chip Multilayer Ceramic Capacitors for General Purpose	6.25Gbps, 1.8V PC Board Equalizer	6.25Gbps, 1.8V PC Board Equalizer	6.25Gbps, 1.8V PC Board Equalizer	6.25Gbps, 1.8V PC Board Equalizer	6.25Gbps, 1.8V PC Board Equalizer
Is it lead-free?	Contains lead	-	-	Lead free	-	Contains lead	Lead free
Is it Rohs certified?	incompatible	-	-	conform to	-	incompatible	conform to
Parts packaging code	DFN	-	-	BGA	-	DFN	DFN
package instruction	TDFN-6	-	-	VFBGA, BGA9,3X3,20	-	TDFN-6	HVSON, SOLCC6,.11,37
Contacts	6	-	-	6	-	6	6
Reach Compliance Code	_compli	-	-	unknow	-	_compli	compli
JESD-30 code	S-PDSO-N6	-	-	S-PBGA-B6	-	S-PDSO-N6	S-PDSO-N6
length	3 mm	-	-	1.52 mm	-	3 mm	3 mm
Number of functions	1	-	-	1	-	1	1
Number of terminals	6	-	-	6	-	6	6
Maximum operating temperature	85 °C	-	-	85 °C	-	85 °C	85 °C
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	-	-	VFBGA	-	HVSON	HVSON
Encapsulate equivalent code	SOLCC6,.11,37	-	-	BGA9,3X3,20	-	SOLCC6,.11,37	SOLCC6,.11,37
Package shape	SQUARE	-	-	SQUARE	-	SQUARE	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	245	-	-	NOT SPECIFIED	-	245	260
power supply	1.8 V	-	-	1.8 V	-	1.8 V	1.8 V
Certification status	Not Qualified	-	-	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	0.8 mm	-	-	0.67 mm	-	0.8 mm	0.8 mm
Maximum slew rate	0.055 mA	-	-	0.055 mA	-	0.055 mA	0.055 mA
Nominal supply voltage	1.8 V	-	-	1.8 V	-	1.8 V	1.8 V
surface mount	YES	-	-	YES	-	YES	YES
Telecom integrated circuit types	LINE EQUALIZER	-	-	LINE EQUALIZER	-	LINE EQUALIZER	LINE EQUALIZER
Temperature level	OTHER	-	-	OTHER	-	OTHER	OTHER
Terminal form	NO LEAD	-	-	BALL	-	NO LEAD	NO LEAD
Terminal pitch	0.95 mm	-	-	0.5 mm	-	0.95 mm	0.95 mm
Terminal location	DUAL	-	-	BOTTOM	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	3 mm	-	-	1.52 mm	-	3 mm	3 mm

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