C1206C151K1GACTM datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> C1206C151K1GACTM

C1206C151K1GACTM: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, C0G, -/+30ppm/Cel TC, 0.00015uF, 1206; CategoryPassive components capacitor; File Size1MB，9 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com; Environmental Compliance

Download Datasheet Parametric View All

C1206C151K1GACTM Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, C0G, -/+30ppm/Cel TC, 0.00015uF, 1206

C1206C151K1GACTM Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
Base Number Matches	1

Preview

Download Datasheet

View All

CERAMIC CHIP CAPACITORS

FEATURES

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

• Tape and reel packaging per EIA481-1. (See page

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

• RoHS Compliant

CAPACITOR OUTLINE DRAWINGS

ELECTRODES

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

DIMENSIONS—MILLIMETERS AND (INCHES)

EIA SIZE

CODE

0201*

0402*

0603

0805*

1206*

1210*

1808

1812

1825*

2220

2225

METRIC

SIZE CODE

0603

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

L - LENGTH

0.6 (.024) ± .03 (.001)

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

W - WIDTH

0.3 ± (.012) ± .03 (.001)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

See page 78

for thickness

dimensions.

THICKNESS

B - BANDWIDTH

0.15 (.006) ± .05 (.002)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

0.60 (.024) ± .35 (.014)

SEPARATION

minimum

N/A

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

Solder Reflow

Solder Wave +

Solder Reflow

MOUNTING

TECHNIQUE

Solder Reflow

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

CAPACITOR ORDERING INFORMATION

(Standard Chips - For

C 0805 C 103 K 5 R A C*

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF J – ±5%

C – ±0.25pF K – ±10%

D – ±0.5pF

M – ±20%

F – ±1%

P – (GMV) – special order only

G – ±2%

Z – +80%, -20%

Military see page

87)

END METALLIZATION

C-Standard (Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

VOLTAGE

- 100V

- 100V 3 - 25V

25V

2 - 200V 4 - 16V

- 50V 8 - 10V

16V

- 200V

- 35V 9 - 6.3V

10V

- 50V

* Part Number Example: C0805C103K5RAC (14 digits - no spaces)

7 - 4V

- 6.3V

7 - 4V

Ceramic Surface Mount

Recommended Resources

How semiconductor holes conduct electricity

Electric contact pressure hydrostatic tower water level automatic control circuit

Electromagnet processing dimensions chart

Reference power supply using bipolar transistors

1KW, 20kHZ, 500V-40V, 25A voltage converter

How to use wireless firmware upgrades for MSP 430 microcontrollers: As devices within the Internet of Things (IoT) become more connected, and customer demands make firmware and software upgrades a critical product requirement, architecting for these updates is a criti...; Jacktang RF/Wirelessly

The ultimate reason for high-frequency radiation exceeding the standard: [i=s]This post was last edited by boyk on 2022-4-28 14:15[/i]1. Product Introduction An industrial control product consists of three parts: power supply, control board, and power board. The radiation ...; boyk Integrated technical exchanges

MicroPython adds support for STM32L432KC: MicroPython has added support for STM32L432KC. You can find the previous NUCLEO_L432KC development board. [url]https://github.com/micropython/micropython/tree/master/ports/stm32/boards/NUCLEO_L432KC[/...; dcexpert MicroPython Open Source section

What to do if the microwave membrane switch fails: I have used the microwave oven for two years, and the membrane switch always has problems. Sometimes the switch does not work, and the machine does not work no matter what I do. I thought it was a pro...; xiaowai90 Integrated technical exchanges

STM32G474RET6, using HRTIM, outputs dual-channel Dual DAC sine waves in DMA mode: STM32G474RET6, using HRTIM, outputs dual-channel Dual DAC sine waves in DMA mode, and the output waveform data can be set by yourself...; zxd121 stm32/stm8

December 3 live broadcast review: MPS inductor solutions help better switching power supply design: Live broadcast time: December 3, 10:00-11:30Live broadcast topic: MPS inductor solutions, help better switching power supply designWatch replay: Click to watchQA summary:1. What are the outstanding ad...; EEWORLD社区 Power technology

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components