CDR32BP511BKUS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> CDR32BP511BKUS

CDR32BP511BKUS: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BP, 30ppm/Cel TC, 0.00051uF, Surface Mount, 1206, CHIP; CategoryPassive components capacitor; File Size1MB，10 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

CDR32BP511BKUS Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BP, 30ppm/Cel TC, 0.00051uF, Surface Mount, 1206, CHIP

CDR32BP511BKUS Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
package instruction	, 1206
Reach Compliance Code	not_compliant
ECCN code	EAR99
Factory Lead Time	13 weeks
capacitance	0.00051 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.3 mm
JESD-609 code	e0
length	3.2 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	10%
Rated (DC) voltage (URdc)	100 V
Guideline	MIL-PRF-55681
size code	1206
surface mount	YES
Temperature characteristic code	BP
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn70Pb30) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	1.6 mm
Base Number Matches	1

Preview

Download Datasheet

View All

CERAMIC CHIP/MIL-PRF-55681

CAPACITOR OUTLINE DRAWINGS

DIMENSIONS—MILLIMETERS AND (INCHES)

STYLE

KEMET

SIZE

CODE

MIN.

MAX.

CDR01

CDR02

CDR03

CDR04

CDR05

CDR06

CDR31

CDR32

CDR33

CDR34

CDR35

C0805

C1805

C1808

C1812

C1825

C2225

C0805

C1206

C1210

C1812

C1825

2.03 ±.38 (.080 ±.015)

4.57 ±.38 (.180 ±.015)

+.51

+.020

4.57

.180

–.38

–.015

5.72 ±.51 (.225 ±.020)

2.00 ±.20 (.078 ±.008)

3.20 ±.20 (.125 ±.008)

3.20 ±.25 (.125 ±.010)

4.50 ±.25 (.176 ±.010)

4.50 ±.30 (.176 ±.012)

(

)

1.27 ±.38 (.050 ±.015)

2.03 ±.38 (.080 ±.015)

3.18 ±.38 (.125 ±.015)

+.51

+.020

6.35

.250

–.38

–.015

6.35 ±.51 (.250 ±.020)

1.25 ±.20 (.049 ±.008)

1.60 ±.20 (.062 ±.008)

2.50 ±.25 (.098 ±.010)

3.20 ±.25 (.125 ±.010)

6.40 ±.30 (.250 ±.012)

.56 (.022)

.51 (.020)

1.40 (.055)

2.03 (.080)

1.30 (.051)

1.50 (.059)

.51 ± 0.25 (.020 ±.010)

.50 ± 0.20 (.020 ±.008)

.50 ± 0.25 (.020 ±.010)

.50 ± 0.30 (.020 ±.012)

(

)

Note:

For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following

amounts:

Length

Width

Length

CDR01

0.51MM (.020)

0.38MM (.015)

CDR02-06

0.64MM (.025)

0.38MM (.015)

CDR31-35

0.60MM (.023)

0.30MM (.012)

MIL-PRF-55681 PART NUMBER ORDERING INFORMATION

CDR01

B P

101 B K

STYLE & SIZE CODE

STYLE

C — Ceramic

D — Dielectric, Fixed Chip

R — Established Reliability

FAILURE RATE LEVEL

(%/1000 hrs.)

TERMINATION FINISH

S — Solder Coated, Final

(SolderGuard I)

U — Base Metalization—

Barrier Metal—Solder

Coated

(SolderGuard I)

W — Base Metalization—

Barrier Metal—Tinned

Tin or (Tin/Lead Alloy)

SolderGuard II

Y — Base Metalization

Barrier Metal—Tinned

(100% Tin)

Solderguard II

RATED TEMPERATURE

–55°C to +125°C

DIELECTRICS

P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE

X —± 15%—without voltage

+ 15%, –25%—with voltage

CAPACITANCE

Expressed in picofarads (pF).

First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.

(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)

CAPACITANCE TOLERANCE

±.1 pF ±.25 pF ±.5 pF ±1%

±5%

±10% ±20%

Z – Base metallization -

barrier metal-tinned (tin/lead

alloy, with a min. of 4% lead)

RATED VOLTAGE

A — 50; B — 100

KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS

C 0805

P 101 K

1 G M

CERAMIC

SIZE CODE

See Table Above

END METALIZATION

L — 70Sn/30Pb Plated (Military codes Z,W,U )

C— 100% Tin Plated (Military code Y)

H – Sn60 Coated (Military code S)

SPECIFICATION

P -MIL-PRF-55681 = CDR01-CDR06

N-MIL-PRF-55681 = CDR31-CDR35

FAILURE RATE

(%/1,000 hrs.)

R — 0.01

S — 0.001

M — 1.0

P — 0.1

CAPACITANCE CODE

Expressed in picofarads (pF).

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 thru 9.9 pF. Example: 2.2 pF –229)

VOLTAGE TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G — BP (C0G/NP0) (±30 PPM/°C)

X — BX (±15% Without Voltage

+15% -25% With Voltage)

CAPACITANCE TOLERANCE

.1 pF

.25 pF

.5 pF

10%

20%

VOLTAGE

1 — 100V, 5 — 50V

Part Number Example: C0805P101K1GML

(14 digits - no spaces)

Ceramic Surface Mount

M — 1.0

P — 0.1

R — 0.01

S — 0.001

Recommended Resources

"Hot cake" heater principle NE555 heater circuit diagram

Working principle diagram and application diagram of silicon controlled thyristor

5V power supply with stable instantaneous backup power included

Equivalent circuit and equivalent functional block diagram of bipolar 555/556

MAX038 multiple waveform oscillator

Venus C6458 power supply

Definition and Difference between DSP Devices and General-Purpose Processors (GPP): Consider an example of digital signal processing, such as a finite impulse response filter (FIR). In mathematical terms, a FIR filter is a series of dot products. It takes an input quantity and an ord...; fish001 DSP and ARM Processors

(Wireless Charging Electric Car) Second Prize of Sichuan Province, Topic C, Chengdu College of University of Electronic Science and Technology of China: [align=left][font=微软雅黑, "][size=14px][size=3][color=#000000]This time we bring a wireless charging electric car. We use the transmitting and receiving ends of the coil for wireless charging, and the r...; sigma Electronics Design Contest

EEWORLD University - Electronic Design from Scratch: Electronic Design from Scratch : https://training.eeworld.com.cn/course/4857Electronic design from scratch, a real zero-based entry to electronic design, an introductory video for electronics enthusia...; 抛砖引玉 Talking

Problems with drawing curves on testing machines: Our company makes testing machines, with a lower computer and an upper computer. The lower computer is connected to a force sensor, and the sampling value is sent to the upper computer for display and...; chenbingjy stm32/stm8

Analysis of electromagnetic compatibility issues in power supply internal systems: [size=4][color=#222222][font="]Current electronic products are constantly developing towards high performance. From multi-functional mobile phones, high-end digital cameras, to various game consoles, ...; fish001 Analogue and Mixed Signal

LCD1602 display program based on stm32: [i=s]This post was last edited by Fu pj on 2019-10-30 16:02[/i]This content is original by EEWORLD forum user Fu pj . If you want to reprint or use it for commercial purposes, you must obtain the auth...; 付pj stm32/stm8

EFM32 smart door lock application case

Overview Smart door locks Refers to locks that are different from traditional mechanical locks and are more intelligent in terms of user identification, security, and management...[Details]
Embedded combined control linear first-order inverted pendulum system

This paper proposes and designs a combined control system based on Googol's swing control, optimal trolley position control, and embedded student pendulum angle control. The online simulation exper...[Details]
U.S. Department of Energy plans to invest $2.91 billion in electric vehicle batteries and energy storage

The U.S. Department of Energy (DOE) is releasing a new round of $2.91 billion (18.5 billion RMB) in funding to overhaul the lithium supply chain for electric vehicle batteries and oth...[Details]
Australia: A paradise for string inverter manufacturers

If Germany is the birthplace of the world's photovoltaic industry, then Australia is definitely a paradise for Chinese string inverter manufacturers. In 2010, several companies that started ou...[Details]
Nine elements of multi-core processor design

Like SMT, CMP is committed to exploring the coarse-grained parallelism of computing. CMP can be seen as the development of large-scale integrated circuit technology. When the chip capacity is large en...[Details]
Simple digital tube electronic clock based on DS1302

#include reg51.h #include intrins.h #include"DS1302.h" #include"KEY.h" #include"IIC.H" #define uchar unsigned char #define uint unsigned int #define LEDIO P0 #define LEDCHIP P2 sbit BEEP=P3^7; /***...[Details]
Design of a proxy authentication server

By combining SOCKSv5 proxy service with Extensible Authentication Protocol (EAP), a proxy authentication server based on SOCKSv5 and EAP is formed, which makes up for the deficiency of firewall pro...[Details]
arm assembly adrl (and the difference between ldr and adr)

Looking at the example in Chapter 6 of "Embedded Linux Application Development", I saw a sentence: adrl r2,men_cfg_val At first I was confused about adr1, but later I found out that it is not the...[Details]
Design of magnetic resistance angle and linear position measurement system

Reluctance angle and linear position measurement systems are often used in motor control and are widely used. The following is a design solution for this measurement system, including hardware select...[Details]
Single Board Computer Monitoring Main Program List and Analysis

Picture 1 ORG 0000H 0000 00 NOP 0001 0130 AJMP START 0003 C2A8 CLR EX0; INT0 entry, used for single-step execution. 0005 02039C LJMP PUSH_REG; Ju...[Details]
Apple plans Apple Watch activity challenge for International Dance Day on April 29

Apple is planning an Apple Watch activity challenge for International Dance Day on Friday, April 29. The activity challenge will appear on the Apple Watch as a notification a few days before th...[Details]
A Power Management Solution for 2.5G and 3G Cellular Phones

Consumers generally have many requirements for the cellular phones they purchase, and long talk time and long standby time are obviously the two most important ones. Although current 2G cellul...[Details]
DAC0832 circuit in D/A converter

DAC0832 is a monolithic DC output 8-bit digital/analog converter made using CMOS technology. As shown in Figure 1, it consists of four parts: an inverted T-type R-2R resistor network, an analog swi...[Details]
51 Microcontroller Learning: I2C-EEPROM Experiment

Experiment name: I2C-EEPROM experiment wiring instructions: Experimental phenomenon: After downloading the program, the right 4 digits of the digital tube display 0. Press the K1 key to write the dat...[Details]
Special chip CS5460A for energy measurement

Abstract: This article introduces the principle, characteristics and typical applications of the single-phase bidirectional power/energy chip CS5460A newly launched by Cirrus Logic Company in th...[Details]

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components