AM2864BE-250/BUA datasheet, PDF

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AM2864BE-250/BUA: DescriptionEEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32; Categorystorage storage; File Size327KB，11 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM2864BE-250/BUA Overview

EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32

AM2864BE-250/BUA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFJ
package instruction	QCCN, LCC32,.45X.55
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	250 ns
command user interface	NO
Data polling	YES
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
page size	32 words
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
ready/busy	YES
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.54 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	NMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
switch bit	NO
width	11.43 mm
Maximum write cycle time (tWC)	10 ms
Base Number Matches	1

AM2864BE-250/BUA Related Products

	AM2864BE-250/BUA	AM2864BE-300/BXA	AM2864BE-300/BUA	AM2864BE-200/BUA	AM2864BE-350/BUA	AM2864BE-350/BXA	AM2864BE-200/BXA	AM2864BE-250/BXA
Description	EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 300ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28	EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 200ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 350ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32	EEPROM, 8KX8, 350ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28	EEPROM, 8KX8, 200ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28	EEPROM, 8KX8, 250ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFJ	DIP	QFJ	QFJ	QFJ	DIP	DIP	DIP
package instruction	QCCN, LCC32,.45X.55	DIP, DIP28,.6	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	QCCN, LCC32,.45X.55	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6
Contacts	32	28	32	32	32	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	250 ns	300 ns	300 ns	200 ns	350 ns	350 ns	200 ns	250 ns
command user interface	NO	NO	NO	NO	NO	NO	NO	NO
Data polling	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-CQCC-N32	R-CDIP-T28	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CDIP-T28	R-CDIP-T28	R-CDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	35.56 mm	13.97 mm	13.97 mm	13.97 mm	35.56 mm	35.56 mm	35.56 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi	65536 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	28	32	32	32	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DIP	QCCN	QCCN	QCCN	DIP	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	DIP28,.6	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
page size	32 words	32 words	32 words	32 words	32 words	32 words	32 words	32 words
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	2.54 mm	4.445 mm	2.54 mm	2.54 mm	2.54 mm	4.445 mm	4.445 mm	4.445 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	YES	NO	NO	NO
technology	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
switch bit	NO	NO	NO	NO	NO	NO	NO	NO
width	11.43 mm	15.24 mm	11.43 mm	11.43 mm	11.43 mm	15.24 mm	15.24 mm	15.24 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
Maker	-	AMD	AMD	AMD	AMD	AMD	AMD	AMD

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