M27C4001-25XF1 datasheet, PDF - EEWORLD Datasheet

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M27C4001-25XF1: Description512KX8 UVPROM, 250ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32; Categorystorage storage; File Size313KB，11 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M27C4001-25XF1 Overview

512KX8 UVPROM, 250ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32

M27C4001-25XF1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	FRIT SEALED, WINDOWED, CERAMIC, DIP-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T32
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.71 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

M27C4001-25XF1 Related Products

	M27C4001-25XF1	M27C4001-20F1	M27C4001-20XF1	M27C4001-25F1
Description	512KX8 UVPROM, 250ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32	512KX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32	512KX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32	512KX8 UVPROM, 250ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	FRIT SEALED, WINDOWED, CERAMIC, DIP-32	FRIT SEALED, WINDOWED, CERAMIC, DIP-32	FRIT SEALED, WINDOWED, CERAMIC, DIP-32	WDIP, DIP32,.6
Contacts	32	32	32	32
Reach Compliance Code	not_compliant	_compli	_compli	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	250 ns	200 ns	200 ns	250 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-GDIP-T32	R-GDIP-T32	R-GDIP-T32	R-GDIP-T32
JESD-609 code	e0	e0	e0	e0
memory density	4194304 bit	4194304 bi	4194304 bi	4194304 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	WDIP	WDIP	WDIP	WDIP
Encapsulate equivalent code	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.71 mm	5.71 mm	5.71 mm	5.71 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	5.25 V	5.5 V	5.25 V	5.5 V
Minimum supply voltage (Vsup)	4.75 V	4.5 V	4.75 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Base Number Matches	1	1	1	-

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