M24M01-HRMN6G datasheet, PDF - EEWORLD Datasheet

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M24M01-HRMN6G: Description256K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8; Categorystorage storage; File Size698KB，47 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M24M01-HRMN6G Overview

256K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8

M24M01-HRMN6G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Contacts	8
Reach Compliance Code	compli
ECCN code	3A991.B.1.B.1
Maximum clock frequency (fCLK)	1 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDMR
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	4.9 mm
memory density	2097152 bi
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2/5 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.005 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE
Base Number Matches	1

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M24M01-R M24M01-DF

1-Mbit serial I²C bus EEPROM

Datasheet

production data

Features

•

Compatible with all I

C bus modes:

– 1 MHz

– 400 kHz

– 100 kHz

•

Memory array:

– 1 Mbit (128 Kbyte) of EEPROM

– Page size: 256 byte

– Additional Write lockable page (M24M01-D

order codes)

•

Single supply voltage and high speed:

– 1 MHz clock from 1.7 V to 5.5 V

•

Write:

– Byte Write within 5 ms

– Page Write within 5 ms

SO8 (MN)

150 mil width

TSSOP8 (DW)

169 mil width

WLCSP (CS, CX)

•

Operating temperature range:

– from -40 °C up to +85 °C

•

Random and sequential Read modes

•

Write protect of the whole memory array

•

Enhanced ESD/Latch-Up protection

•

More than 4 million Write cycles

•

More than 200-years data retention

Unsawn wafer

Packages

•

SO8 ECOPACK2

•

TSSOP8 ECOPACK2

•

WLCSP ECOPACK2

•

Unsawn wafer (each die is tested)

October 2017

This is information on a product in full production.

DocID12943 Rev 14

1/47

www.st.com

Contents

M24M01-R M24M01-DF

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

(ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.6.1

2.6.2

2.6.3

2.6.4

Operating supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

4.2

4.3

4.4

4.5

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write Identification Page (M24M01-D only) . . . . . . . . . . . . . . . . . . . . . . 17

Lock Identification Page (M24M01-D only) . . . . . . . . . . . . . . . . . . . . . . 17

ECC (Error Correction Code) and Write cycling . . . . . . . . . . . . . . . . . . 17

Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 18

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2.1

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List of tables

M24M01-R M24M01-DF

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Most significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Least significant address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Operating conditions (voltage range F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

DC characteristics (M24M01-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

DC characteristics (M24M01-DF, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1 MHz AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Ordering information scheme (unsawn wafer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4/47

DocID12943 Rev 14

M24M01-R M24M01-DF

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

WLCSP connections (top view, marking side,

with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Chip enable inputs connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Maximum Rbus value versus bus parasitic capacitance (Cbus) for

an I2C bus at maximum frequency fC = 400 kHz

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Maximum R

bus

value versus bus parasitic capacitance C

bus

) for

an I

C bus at maximum frequency f

= 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline . 34

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

WLCSP- 8-bump, 2.578 x 1.716 mm, wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

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Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8	0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
Contacts	8	8	8	8	8	8	8	8	8	8
Reach Compliance Code	compli	compli	compli	compli	compli	compliant	compli	compli	compli	compli
ECCN code	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1	3A991.B.1.B.1
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	0.4 MHz	1 MHz	1 MHz	0.4 MHz	0.4 MHz	0.4 MHz
Data retention time - minimum	40	40	40	40	40	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDMR	1010DDMR	1010DDMR	1010DDMR	1010DDMR	1010DDMR	1010DDMR	1010DDMR	1010DDMR	1010DDMR
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
memory density	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bi	2097152 bit	2097152 bi	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8	8	8
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	SOP	SOP	SOP	SOP	SOP	SOP	SOP
Encapsulate equivalent code	SOP8,.25	SOP8,.3	SOP8,.3	SOP8,.25	SOP8,.25	SOP8,.3	SOP8,.3	SOP8,.3	SOP8,.25	SOP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	260	260	260
power supply	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	2.5 mm	2.5 mm	1.75 mm	1.75 mm	2.5 mm	2.5 mm	2.5 mm	1.75 mm	2.5 mm
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum standby current	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA	0.005 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	40	40	30
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free
Maker	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics

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