A62S8308 Series
Preliminary
Document Title
256K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No.
0.0
0.1
0.2
256K X 8 BIT LOW VOLTAGE CMOS SRAM
History
Initial issue
Modify V
CC
max from 3.3V to 3.6V
Add 55ns grade spec. for VCC = 3.0V to 3.6V
Issue Date
December 6, 1999
December 20, 2000
March 23, 2001
Remark
Preliminary
PRELIMINARY
(March, 2001, Version 0.2)
AMIC Technology, Inc.
A62S8308 Series
Preliminary
Features
n
Power supply range: 2.7V to 3.6V
n
Access times: 55ns (max.): for VCC = 3.0V to 3.6V
70ns (max.): for VCC = 2.7V to 3.6V
n
Current:
A62S8308-S series:
Operating: 40mA (max.)
Standby: 10µA (max.)
A62S8308-SI series:
Operating: 40mA (max.)
Standby: 15µA (max.)
n
Extended operating temperature range:-25°C to 85°C
for –SI series
n
n
n
n
Full static operation, no clock or refreshing required
All inputs and outputs are directly TTL compatible
Common I/O using three-state output
Output enable and two chip enable inputs for easy
application
n
Data retention voltage: 2V (min.)
n
Available in 32-pin SOP, TSOP, sTSOP (8X
13.4mm) forward type and 36-ball Mini BGA (6X8)
packages
256K X 8 BIT LOW VOLTAGE CMOS SRAM
General Description
The A62S8308 is a low operating current 2,097,152-bit
static random access memory organized as 262,144
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for power down and
a device enable and an output enable input are included
for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
n
SOP
n
TSOP/(sTSOP)
(forward type)
n
Mini BGA (6X8) Top View
A17
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
I/O
1
I/O
2
GND
1
2
3
4
5
6
32
31
30
29
28
27
VCC
CE2
WE
A13
A8
A9
A11
OE
A10
CE1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
~
A15
A11
A9
A8
A13
WE
CE2
A15
VCC
A17
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
GND
I/O
2
I/O
1
I/O
0
A0
A1
A2
A3
2
A1
A2
3
CE2
WE
4
A3
A4
A5
5
A6
A7
6
A8
I/O
0
I/O
1
VCC
VSS
A
B
C
D
E
F
G
H
A0
I/O
4
I/O
5
VSS
VCC
I/O
6
I/O
7
A9
NC
A62S8308M
7
8
9
10
11
12
13
14
15
16
26
25
24
23
22
21
20
19
18
17
A62S8308V
(A62S8308X)
NC
OE
CE1
A17
A16
A12
A15
A13
I/O
2
I/O
3
A14
~
~
A10
A11
PRELIMINARY
(March, 2001, Version 0.2)
1
AMIC Technology, Inc.
A62S8308 Series
Block Diagram
A0
VCC
GND
A15
A16
A17
ROW
DECODER
1024 X 2048
MEMORY ARRAY
I/O
0
INPUT DATA
CIRCUIT
COLUMN I/O
I/O
7
CE2
CE1
OE
WE
CONTROL
CIRCUIT
Pin Descriptions - SOP
Pin No.
1 - 12, 23,
25 - 28, 31
13 - 15,
17 - 21
16
22
24
29
30
32
Symbol
A0 - A17
Description
Address Inputs
Pin Description - TSOP/sTSOP
Pin No.
1 - 4, 7,
9 - 20, 31
5
6
8
21 - 23,
25 - 29
24
30
32
Symbol
A0 - A17
WE
Description
Address Inputs
Write Enable
Chip Enable 2
Power Supply
Data Inputs/Outputs
Ground
Chip Enable 1
Output Enable
I/O
0
- I/O
7
GND
CE1
OE
WE
Data Inputs/Outputs
Ground
Chip Enable 1
Output Enable
Write Enable
Chip Enable 2
Power Supply
CE2
VCC
I/O
0
- I/O
7
GND
CE1
OE
CE2
VCC
PRELIMINARY
(March, 2001, Version 0.2)
2
AMIC Technology, Inc.
A62S8308 Series
Recommended DC Operating Conditions
(T
A
= 0°C to + 70°C or -25°C to 85°C)
Symbol
VCC
GND
V
IH
V
IL
C
L
TTL
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Output Load
Output Load
Min.
2.7
0
2.4
-0.3
-
-
Typ.
3.0
0
-
-
-
-
Max.
3.6
0
VCC + 0.3
+0.6
30
1
Unit
V
V
V
V
pF
-
Absolute Maximum Ratings*
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, P
T
. . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
Symbol
Parameter
(T
A
= 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)
A62S8308-55S/70S
Min.
Max.
1
A62S8308-55SI/70SI
Min.
-
Max.
1
µA
V
IN
= GND to VCC
CE1
= V
IH
or CE2 = V
IL
or
OE
= V
IH
or
WE
= V
IL
V
I/O
= GND to VCC
CE1
= V
IL
, CE2 = V
IH
I
I/O
= 0mA
Unit
Conditions
I
LI
Input Leakage
Current
Output Leakage
Current
Active Power
Supply Current
-
I
LO
-
1
-
1
µA
I
CC
-
3
-
3
mA
I
CC1
Dynamic Operating
Current
I
CC2
-
40
-
40
mA
Min. Cycle, Duty = 100%
CE1
= V
IL
, CE2 = V
IH
I
I/O
= 0mA
CE1
= V
IL
, CE2 = V
IH
V
IH
= VCC, V
IL
= 0V,
f = 1MHz, I
I/O
= 0mA
-
10
-
10
mA
PRELIMINARY
(March, 2001, Version 0.2)
3
AMIC Technology, Inc.
A62S8308 Series
DC Electrical Characteristics (continued)
Symbol
Parameter
A62S8308-55S/70S
Min.
I
SB
-
Max.
0.5
A62S8308-55SI/70SI
Min.
-
Max.
0.5
mA
CE1
= V
IH
or
CE2 = V
IL
CE1
≥
VCC - 0.2V
CE2
≥
VCC - 0.2V
V
IN
≥
0V
Unit
Conditions
I
SB1
Standby Power
Supply Current
-
10
-
15
µA
I
SB2
V
OL
V
OH
Output Low Voltage
Output High Voltage
-
-
2.4
10
0.4
-
-
-
2.4
15
0.4
-
µA
V
V
CE2
≤
0.2V
V
IN
≥
0V
I
OL
= 2.1mA
I
OH
= -1.0mA
Truth Table
Mode
Standby
CE1
CE2
X
L
H
H
H
OE
WE
I/O Operation
High Z
High Z
High Z
D
OUT
D
IN
Supply Current
I
SB
, I
SB1
I
SB
, I
SB2
I
CC,
I
CC1,
I
CC2
I
CC,
I
CC1,
I
CC2
I
CC,
I
CC1,
I
CC2
H
X
X
X
H
L
X
X
X
H
H
L
Output Disable
Read
Write
Note: X = H or L
L
L
L
Capacitance
(T
A
= 25°C, f = 1.0MHz)
Symbol
C
IN
*
C
I/O
*
Parameter
Input Capacitance
Input/Output Capacitance
Min.
Max.
6
8
Unit
pF
pF
Conditions
V
IN
= 0V
V
I/O
= 0V
* These parameters are sampled and not 100% tested.
PRELIMINARY
(March, 2001, Version 0.2)
4
AMIC Technology, Inc.
DSP and ARM Processors
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