NAND Gate, TTL, CDIP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.06 A |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 40 mA |
| Prop。Delay @ Nom-Sup | 12 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | MIL-STD-883 Class B (Modified) |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| S54H40F/883B | S54H40W/883B | N74H40F | S54H40F/883C | N74H40A | |
|---|---|---|---|---|---|
| Description | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDFP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, CDIP14 | NAND Gate, TTL, PDIP14 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.06 A | 0.06 A | 0.06 A | 0.06 A | 0.06 A |
| Number of terminals | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | - |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DFP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
| Prop。Delay @ Nom-Sup | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Filter level | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class C | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| Maker | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) |
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