S54H40F/883C datasheet, PDF - EEWORLD Datasheet

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S54H40F/883C: DescriptionNAND Gate, TTL, CDIP14; Categorylogic logic; File Size69KB，1 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S54H40F/883C Overview

NAND Gate, TTL, CDIP14

S54H40F/883C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.06 A
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum supply current (ICC)	40 mA
Prop。Delay @ Nom-Sup	12 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	MIL-STD-883 Class C
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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S54H40F/883C Related Products

	S54H40F/883C	S54H40W/883B	N74H40F	S54H40F/883B	N74H40A
Description	NAND Gate, TTL, CDIP14	NAND Gate, TTL, CDFP14	NAND Gate, TTL, CDIP14	NAND Gate, TTL, CDIP14	NAND Gate, TTL, PDIP14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP14,.3	DFP, FL14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	R-XDFP-F14	R-XDIP-T14	R-XDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.06 A	0.06 A	0.06 A	0.06 A	0.06 A
Number of terminals	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	70 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-	-55 °C	-
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DFP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	FL14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	40 mA	40 mA	40 mA	40 mA	40 mA
Prop。Delay @ Nom-Sup	12 ns	12 ns	12 ns	12 ns	12 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Filter level	MIL-STD-883 Class C	MIL-STD-883 Class B (Modified)	-	MIL-STD-883 Class B (Modified)	-
Base Number Matches	1	1	1	1	-
Maker	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)

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