IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit
Parameter Name | Attribute value |
package instruction | DIP, |
Reach Compliance Code | unknown |
Other features | SELECTABLE MAKE/BREAK RATIO 1:2 |
JESD-30 code | R-PDIP-T18 |
length | 21.6 mm |
damage rate | 1:1.5 |
Number of functions | 1 |
Number of terminals | 18 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -25 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Maximum seat height | 4.7 mm |
Maximum slew rate | 0.4 mA |
Nominal supply voltage | 3 V |
surface mount | NO |
Telecom integrated circuit types | TELEPHONE DIALER CIRCUIT |
Temperature level | OTHER |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
PCD3324CP | PCD3327CP | PCD3327CT-T | PCD3327CT | PCD3320CD | PCD3320CP | PCD3321CD | PCD3322CP | PCD3326CP | PCD3327U | |
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Description | IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit | IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit | IC TELEPHONE DIALER CKT, PDSO20, MINI, PLASTIC, SOT-163-1, 20 PIN, Telephone Circuit | IC TELEPHONE DIALER CKT, PDSO20, Telephone Circuit | IC TELEPHONE DIALER CKT, CDIP18, CERAMIC, SOT-133B, DIP-18, Telephone Circuit | IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit | IC TELEPHONE DIALER CKT, CDIP18, CERAMIC, SOT-133B, DIP-18, Telephone Circuit | IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit | IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit | IC TELEPHONE DIALER CKT, UUC18, Telephone Circuit |
package instruction | DIP, | DIP, | SOP, | SOP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIE, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Other features | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 | SELECTABLE MAKE/BREAK RATIO 1:2 |
JESD-30 code | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-G20 | R-PDSO-G20 | R-GDIP-T18 | R-PDIP-T18 | R-GDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | X-XUUC-N18 |
damage rate | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 | 1:1.5 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 18 | 18 | 20 | 20 | 18 | 18 | 18 | 18 | 18 | 18 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
encapsulated code | DIP | DIP | SOP | SOP | DIP | DIP | DIP | DIP | DIP | DIE |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | UNCASED CHIP |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA |
Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | NO | NO | YES | YES | NO | NO | NO | NO | NO | YES |
Telecom integrated circuit types | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT | TELEPHONE DIALER CIRCUIT |
Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER |
length | 21.6 mm | 21.6 mm | 12.8 mm | 12.8 mm | - | 21.6 mm | - | 21.6 mm | 21.6 mm | - |
Maximum seat height | 4.7 mm | 4.7 mm | 2.65 mm | 2.65 mm | 5.08 mm | 4.7 mm | 5.08 mm | 4.7 mm | 4.7 mm | - |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
width | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | - | - |
Maker | - | NXP | NXP | NXP | NXP | NXP | - | - | NXP | NXP |