PCD3326CP datasheet, PDF - EEWORLD Datasheet

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PCD3326CP: DescriptionIC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit; CategoryWireless rf/communication Telecom circuit; File Size789KB，30 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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PCD3326CP Overview

IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit

PCD3326CP Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	DIP,
Reach Compliance Code	unknown
Other features	SELECTABLE MAKE/BREAK RATIO 1:2
JESD-30 code	R-PDIP-T18
length	21.6 mm
damage rate	1:1.5
Number of functions	1
Number of terminals	18
Maximum operating temperature	70 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	4.7 mm
Maximum slew rate	0.4 mA
Nominal supply voltage	3 V
surface mount	NO
Telecom integrated circuit types	TELEPHONE DIALER CIRCUIT
Temperature level	OTHER
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

PCD3326CP Related Products

	PCD3326CP	PCD3327CP	PCD3327CT-T	PCD3327CT	PCD3320CD	PCD3320CP	PCD3321CD	PCD3322CP	PCD3324CP	PCD3327U
Description	IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit	IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit	IC TELEPHONE DIALER CKT, PDSO20, MINI, PLASTIC, SOT-163-1, 20 PIN, Telephone Circuit	IC TELEPHONE DIALER CKT, PDSO20, Telephone Circuit	IC TELEPHONE DIALER CKT, CDIP18, CERAMIC, SOT-133B, DIP-18, Telephone Circuit	IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit	IC TELEPHONE DIALER CKT, CDIP18, CERAMIC, SOT-133B, DIP-18, Telephone Circuit	IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit	IC TELEPHONE DIALER CKT, PDIP18, Telephone Circuit	IC TELEPHONE DIALER CKT, UUC18, Telephone Circuit
package instruction	DIP,	DIP,	SOP,	SOP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIE,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2	SELECTABLE MAKE/BREAK RATIO 1:2
JESD-30 code	R-PDIP-T18	R-PDIP-T18	R-PDSO-G20	R-PDSO-G20	R-GDIP-T18	R-PDIP-T18	R-GDIP-T18	R-PDIP-T18	R-PDIP-T18	X-XUUC-N18
damage rate	1:1.5	1:1.5	1:1.5	1:1.5	1:1.5	1:1.5	1:1.5	1:1.5	1:1.5	1:1.5
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	18	18	20	20	18	18	18	18	18	18
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	DIP	DIP	SOP	SOP	DIP	DIP	DIP	DIP	DIP	DIE
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	UNCASED CHIP
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	NO	NO	YES	YES	NO	NO	NO	NO	NO	YES
Telecom integrated circuit types	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT	TELEPHONE DIALER CIRCUIT
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	UPPER
Maker	NXP	NXP	NXP	NXP	NXP	NXP	-	-	-	NXP
length	21.6 mm	21.6 mm	12.8 mm	12.8 mm	-	21.6 mm	-	21.6 mm	21.6 mm	-
Maximum seat height	4.7 mm	4.7 mm	2.65 mm	2.65 mm	5.08 mm	4.7 mm	5.08 mm	4.7 mm	4.7 mm	-
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-
width	7.62 mm	7.62 mm	7.5 mm	7.5 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	-
Base Number Matches	-	1	1	1	1	-	1	1	1	-

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