IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | not_compliant |
Maximum access time | 450 ns |
JESD-30 code | R-XDIP-T24 |
memory density | 8192 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of terminals | 24 |
word count | 1024 words |
character code | 1000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | MOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
TMS2708-45JL | TMS2708-35JL | TMS27L08-45JL | |
---|---|---|---|
Description | IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC | IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC | IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant |
Maximum access time | 450 ns | 350 ns | 450 ns |
JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
memory density | 8192 bit | 8192 bit | 8192 bit |
memory width | 8 | 8 | 8 |
Number of terminals | 24 | 24 | 24 |
word count | 1024 words | 1024 words | 1024 words |
character code | 1000 | 1000 | 1000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 1KX8 | 1KX8 | 1KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO |
technology | MOS | MOS | MOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 |
Memory IC Type | OTP ROM | - | OTP ROM |