Standard SRAM, 16KX4, 25ns, CMOS,
Parameter Name | Attribute value |
Reach Compliance Code | unknown |
Maximum access time | 25 ns |
I/O type | SEPARATE |
memory density | 65536 bit |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16KX4 |
Output characteristics | 3-STATE |
Encapsulate equivalent code | DIE OR CHIP |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.02 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.07 mA |
Nominal supply voltage (Vsup) | 5 V |
technology | CMOS |
Temperature level | COMMERCIAL |
Base Number Matches | 1 |
HM0-65791H-5 | HM3-65791H-5 | HM3-65791K-5 | HM3-65791K-9 | HM3-65791M-5 | HM3-65791M-9 | HM0-65791K-5 | HM0-65791M-5 | |
---|---|---|---|---|---|---|---|---|
Description | Standard SRAM, 16KX4, 25ns, CMOS, | Standard SRAM, 16KX4, 25ns, CMOS, PDIP28, | Standard SRAM, 16KX4, 35ns, CMOS, PDIP28, | Standard SRAM, 16KX4, 35ns, CMOS, PDIP28, | Standard SRAM, 16KX4, 45ns, CMOS, PDIP28, | Standard SRAM, 16KX4, 45ns, CMOS, PDIP28, | Standard SRAM, 16KX4, 35ns, CMOS, | Standard SRAM, 16KX4, 45ns, CMOS, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 25 ns | 25 ns | 35 ns | 35 ns | 45 ns | 45 ns | 35 ns | 45 ns |
I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
organize | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Encapsulate equivalent code | DIE OR CHIP | DIP28,.3 | DIP28,.3 | DIP28,.3 | DIP28,.3 | DIP28,.3 | DIE OR CHIP | DIE OR CHIP |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Maximum slew rate | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | - | - |
Is Samacsys | - | N | N | N | N | N | - | - |
JESD-30 code | - | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | - | - |
JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | - | - |
Number of terminals | - | 28 | 28 | 28 | 28 | 28 | - | - |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
encapsulated code | - | DIP | DIP | DIP | DIP | DIP | - | - |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
Package form | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - |
surface mount | - | NO | NO | NO | NO | NO | - | - |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - |
Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
Terminal location | - | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |