Field Programmable Gate Array, 2400 CLBs, 145000 Gates, 357MHz, 10800-Cell, CMOS, PBGA456, FBGA-456
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Objectid | 1962013854 |
Parts packaging code | BGA |
package instruction | FBGA-456 |
Contacts | 456 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.D |
Other features | MAXIMUM USABLE GATES = 400000 |
maximum clock frequency | 357 MHz |
Combined latency of CLB-Max | 0.47 ns |
JESD-30 code | S-PBGA-B456 |
JESD-609 code | e0 |
length | 23 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 2400 |
Equivalent number of gates | 145000 |
Number of entries | 410 |
Number of logical units | 10800 |
Output times | 410 |
Number of terminals | 456 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 2400 CLBS, 145000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA456,22X22,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.6 mm |
Maximum supply voltage | 1.89 V |
Minimum supply voltage | 1.71 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |