Flash, 4MX16, 70ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | TBGA, BGA64,8X8,40 |
Contacts | 64 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.A |
Maximum access time | 70 ns |
startup block | BOTTOM/TOP |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B64 |
length | 13 mm |
memory density | 67108864 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 16,126 |
Number of terminals | 64 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 4MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Encapsulate equivalent code | BGA64,8X8,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
page size | 8 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/3.3 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 4K,32K |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.055 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | YES |
type | NOR TYPE |
width | 11 mm |
Base Number Matches | 1 |