CD4010BDMSH datasheet, PDF - EEWORLD Datasheet

CD4010BDMSH: DescriptionIC,LOGIC GATE,HEX BUFFER,CMOS, RAD HARD,DIP,16PIN,CERAMIC; Categorylogic logic; File Size291KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD4010BDMSH Overview

IC,LOGIC GATE,HEX BUFFER,CMOS, RAD HARD,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.00036 A
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Prop。Delay @ Nom-Sup	270 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	38535V;38534K;883S
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
total dose	1M Rad(Si) V
Base Number Matches	1

	CD4010BDMSH	CD4010BFMSH	CD4010BKMSH
Description	IC,LOGIC GATE,HEX BUFFER,CMOS, RAD HARD,DIP,16PIN,CERAMIC	IC,LOGIC GATE,HEX BUFFER,CMOS, RAD HARD,DIP,16PIN,CERAMIC	IC,LOGIC GATE,HEX BUFFER,CMOS, RAD HARD,FP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	not_compliant	not_compliant	not_compliant
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16
JESD-609 code	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.00036 A	0.00036 A	0.00036 A
Number of terminals	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DFP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	FLATPACK
power supply	5/15 V	5/15 V	5/15 V
Prop。Delay @ Nom-Sup	270 ns	270 ns	270 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO
Filter level	38535V;38534K;883S	38535V;38534K;883S	38535V;38534K;883S
surface mount	NO	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
total dose	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V
Maker	Renesas Electronics Corporation	-	Renesas Electronics Corporation
Base Number Matches	1	1	-

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