SRAM Module, 512KX8, 35ns, CMOS
Parameter Name | Attribute value |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 35 ns |
Other features | ALSO CONFIGURABLE AS 128K X 32 |
JESD-30 code | R-XSMA-T64 |
memory density | 4194304 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal location | SINGLE |
Base Number Matches | 1 |
AK632128G-35 | AK632128G-25 | AK632128G-20 | AK632128G-15 | |
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Description | SRAM Module, 512KX8, 35ns, CMOS | SRAM Module, 512KX8, 25ns, CMOS | SRAM Module, 512KX8, 20ns, CMOS | SRAM Module, 512KX8, 15ns, CMOS |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 35 ns | 25 ns | 20 ns | 15 ns |
Other features | ALSO CONFIGURABLE AS 128K X 32 | ALSO CONFIGURABLE AS 128K X 32 | ALSO CONFIGURABLE AS 128K X 32 | ALSO CONFIGURABLE AS 128K X 32 |
JESD-30 code | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 | R-XSMA-T64 |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 64 | 64 | 64 | 64 |
word count | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | SINGLE | SINGLE | SINGLE | SINGLE |
Maker | - | ACCUTEK | ACCUTEK | ACCUTEK |