M27C2001-10XF1 datasheet, PDF - EEWORLD Datasheet

M27C2001-10XF1: Description256KX8 UVPROM, 100ns, CDIP32, LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32; Categorystorage storage; File Size236KB，25 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M27C2001-10XF1 Overview

256KX8 UVPROM, 100ns, CDIP32, LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	DIP
package instruction	LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-CDIP-T32
JESD-609 code	e3
length	41.885 mm
memory density	2097152 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.72 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.035 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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