S71GS256NC0BFWAP2 datasheet, PDF

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S71GS256NC0BFWAP2: DescriptionMemory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84; Categorystorage storage; File Size2MB，195 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S71GS256NC0BFWAP2 Overview

Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

S71GS256NC0BFWAP2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Contacts	84
Reach Compliance Code	unknown
JESD-30 code	R-PBGA-B84
JESD-609 code	e1
length	11.6 mm
memory density	268435456 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	84
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.1 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm
Base Number Matches	1

S71GS256NC0BFWAP2 Related Products

	S71GS256NC0BFWAP2	S71GS256NC0BAWAP2	S71GS256NC0BFWAP3	S71GS256NC0BAWAP0	S71GS256NC0BAWAP3	S71GS256NC0BFWAP0
Description	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84	Memory Circuit, 16MX16, CMOS, PBGA84, 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Is it Rohs certified?	conform to	incompatible	conform to	incompatible	incompatible	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	TFBGA,	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	TFBGA,	TFBGA,	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Contacts	84	84	84	84	84	84
Reach Compliance Code	unknown	compliant	unknown	compliant	compli	unknow
JESD-30 code	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84
JESD-609 code	e1	e0	e1	e0	e0	e1
length	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm
memory density	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bi	268435456 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	84	84	84	84	84	84
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	NOT SPECIFIED	40	NOT SPECIFIED	NOT SPECIFIED	40
width	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
Maker	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION

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