ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, Hybrid, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | HERMETIC SEALED, CERAMIC PACKAGE-28 |
Reach Compliance Code | unknown |
Maximum analog input voltage | 16.5 V |
Minimum analog input voltage | -16.5 V |
Maximum conversion time | 25 µs |
Converter type | ADC SUBSYSTEM |
JESD-30 code | R-CDIP-T28 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.025% |
Nominal negative supply voltage | -15 V |
Number of digits | 12 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output bit code | BINARY, OFFSET BINARY |
Output format | PARALLEL, WORD |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5,+-15 V |
Certification status | Not Qualified |
Sampling rate | 0.056 MHz |
Sample and hold/Track and hold | SAMPLE |
Maximum slew rate | 17 mA |
Nominal supply voltage | 15 V |
surface mount | NO |
technology | HYBRID |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
Base Number Matches | 1 |
HS9474J-1 | HS9474K-1 | HS9474K-2 | HS9474J-2 | |
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Description | ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, Hybrid, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 | ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, Hybrid, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 | ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, Hybrid, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 | ADC Subsystem, 12-Bit, 1 Func, Parallel, Word Access, Hybrid, CDIP28, HERMETIC SEALED, CERAMIC PACKAGE-28 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | HERMETIC SEALED, CERAMIC PACKAGE-28 | HERMETIC SEALED, CERAMIC PACKAGE-28 | HERMETIC SEALED, CERAMIC PACKAGE-28 | HERMETIC SEALED, CERAMIC PACKAGE-28 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Maximum analog input voltage | 16.5 V | 16.5 V | 16.5 V | 16.5 V |
Minimum analog input voltage | -16.5 V | -16.5 V | -16.5 V | -16.5 V |
Maximum conversion time | 25 µs | 25 µs | 25 µs | 25 µs |
Converter type | ADC SUBSYSTEM | ADC SUBSYSTEM | ADC SUBSYSTEM | ADC SUBSYSTEM |
JESD-30 code | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 | R-CDIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 |
Maximum linear error (EL) | 0.025% | 0.012% | 0.012% | 0.025% |
Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V |
Number of digits | 12 | 12 | 12 | 12 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Output bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Sampling rate | 0.056 MHz | 0.056 MHz | 0.056 MHz | 0.056 MHz |
Sample and hold/Track and hold | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
Maximum slew rate | 17 mA | 17 mA | 17 mA | 17 mA |
Nominal supply voltage | 15 V | 15 V | 15 V | 15 V |
surface mount | NO | NO | NO | NO |
technology | HYBRID | HYBRID | HYBRID | HYBRID |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
Base Number Matches | 1 | 1 | 1 | - |