T89C51CC02-TDSIL datasheet, PDF

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T89C51CC02-TDSIL: DescriptionMicrocontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO24,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size819KB，137 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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T89C51CC02-TDSIL Overview

Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO24,

T89C51CC02-TDSIL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	TEMIC
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-PDSO-G24
JESD-609 code	e0
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP24,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	3 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	16384
ROM programmability	FLASH
speed	40 MHz
Nominal supply voltage	3 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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Description	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO24,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PQCC28,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PQCC28,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO24,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PDSO28,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 40MHz, PQCC28,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC	TEMIC
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
bit size	8	8	8	8	8	8	8	8
CPU series	8051	8051	8051	8051	8051	8051	8051	8051
JESD-30 code	R-PDSO-G24	S-PQCC-J28	R-PDSO-G28	S-PQCC-J28	R-PDSO-G24	R-PDSO-G28	R-PDSO-G28	S-PQCC-J28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	24	28	28	28	24	28	28	28
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	QCCJ	TSSOP	QCCJ	SOP	SOP	SOP	QCCJ
Encapsulate equivalent code	SOP24,.4	LDCC28,.5SQ	TSSOP28,.25	LDCC28,.5SQ	SOP24,.4	SOP28,.4	SOP28,.4	LDCC28,.5SQ
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER
power supply	3 V	5 V	5 V	3 V	5 V	5 V	3 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256	256	256	256	256	256
rom(word)	16384	16384	16384	16384	16384	16384	16384	16384
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz	40 MHz
Nominal supply voltage	3 V	5 V	5 V	3 V	5 V	5 V	3 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	J BEND	GULL WING	J BEND	GULL WING	GULL WING	GULL WING	J BEND
Terminal pitch	1.27 mm	1.27 mm	0.635 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD

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