UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | WINDOWED, CERDIP-32 |
Reach Compliance Code | compliant |
Maximum access time | 200 ns |
JESD-30 code | R-GDIP-T32 |
JESD-609 code | e0 |
memory density | 1048576 bit |
Memory IC Type | UVPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |
UPD27C1001AD-20 | UPD27C1001AD15 | |
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Description | UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | 128KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERDIP-32 |
Is it Rohs certified? | incompatible | incompatible |
package instruction | WINDOWED, CERDIP-32 | WDIP, |
Reach Compliance Code | compliant | unknown |
Maximum access time | 200 ns | 150 ns |
JESD-30 code | R-GDIP-T32 | R-GDIP-T32 |
JESD-609 code | e0 | e0 |
memory density | 1048576 bit | 1048576 bit |
Memory IC Type | UVPROM | UVPROM |
memory width | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 32 | 32 |
word count | 131072 words | 131072 words |
character code | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 128KX8 | 128KX8 |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP | WDIP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE, WINDOW | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm |