Flash Module, 32MX8, 200ns, CHIP66
Parameter Name | Attribute value |
package instruction | , |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 200 ns |
Other features | CONFIGURABLE AS 8M X 32; AUTOMATIC WRITE; 10K WRITE/ERASE ENDURANCE MIN |
Spare memory width | 16 |
Durability | 10000 Write/Erase Cycles |
JESD-30 code | R-CHIP-T66 |
memory density | 268435456 bit |
Memory IC Type | FLASH MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 32MX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Programming voltage | 12 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal location | HEX |
type | NOR TYPE |
Base Number Matches | 1 |