Standard SRAM, 64KX32, 4ns, CMOS, PQFP100,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | QFP, QFP100,.7X.9 |
Reach Compliance Code | unknown |
Maximum access time | 4 ns |
Maximum clock frequency (fCLK) | 200 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
memory density | 2097152 bit |
Memory IC Type | STANDARD SRAM |
memory width | 32 |
Number of terminals | 100 |
word count | 65536 words |
character code | 64000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX32 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP100,.7X.9 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.005 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.4 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
IC61S6432-200PQ | IC61S6432-166TQ | IC61S6432-166PQ | IC61S6432-133TQ | IC61S6432-200TQ | IC61S6432-133PQ | IC61S6432-117TQ | IC61S6432-117TQI | IC61S6432-117PQ | IC61S6432-117PQI | |
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Description | Standard SRAM, 64KX32, 4ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 4ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, | Standard SRAM, 64KX32, 5ns, CMOS, PQFP100, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | QFP, QFP100,.7X.9 | QFP, QFP100,.63X.87 | QFP, QFP100,.7X.9 | QFP, QFP100,.63X.87 | QFP, QFP100,.63X.87 | QFP, QFP100,.7X.9 | QFP, QFP100,.63X.87 | QFP, QFP100,.63X.87 | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 4 ns | 5 ns | 5 ns | 5 ns | 4 ns | 5 ns | 5 ns | 5 ns | 5 ns | 5 ns |
Maximum clock frequency (fCLK) | 200 MHz | 166 MHz | 166 MHz | 133 MHz | 200 MHz | 133 MHz | 117 MHz | 117 MHz | 117 MHz | 117 MHz |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
organize | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
Encapsulate equivalent code | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.7X.9 | QFP100,.7X.9 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.01 A | 0.005 A | 0.01 A |
Minimum standby current | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
Maximum slew rate | 0.4 mA | 0.215 mA | 0.215 mA | 0.205 mA | 0.4 mA | 0.205 mA | 0.195 mA | 0.205 mA | 0.195 mA | 0.205 mA |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maker | - | Integrated Circuit Solution Inc. | Integrated Circuit Solution Inc. | - | - | Integrated Circuit Solution Inc. | Integrated Circuit Solution Inc. | Integrated Circuit Solution Inc. | Integrated Circuit Solution Inc. | Integrated Circuit Solution Inc. |