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MPC8360EVVADDHA

Description
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,112 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance  
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MPC8360EVVADDHA Overview

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC

MPC8360EVVADDHA Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Reach Compliance Codeunknown
bit size32
JESD-30 codeS-PBGA-B740
JESD-609 codee3
Humidity sensitivity level3
Number of terminals740
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA740,37X37,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1.8/2.5,3.3 V
Certification statusNot Qualified
speed266 MHz
surface mountYES
technologyCMOS
Terminal surfaceMATTE TIN
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

MPC8360EVVADDHA Related Products

MPC8360EVVADDHA MPC8360VVADDHA MPC8360ZUAHFHA MPC8360EZUADDHA MPC8360ZUADDHA
Description IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC
Is it lead-free? Lead free Lead free Contains lead Contains lead Contains lead
Is it Rohs certified? conform to conform to incompatible incompatible incompatible
Reach Compliance Code unknown unknown not_compliant not_compliant not_compliant
bit size 32 32 32 32 32
JESD-30 code S-PBGA-B740 S-PBGA-B740 S-PBGA-B740 S-PBGA-B740 S-PBGA-B740
JESD-609 code e3 e3 e0 e0 e0
Humidity sensitivity level 3 3 3 3 3
Number of terminals 740 740 740 740 740
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA740,37X37,40 BGA740,37X37,40 BGA740,37X37,40 BGA740,37X37,40 BGA740,37X37,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 225 225 225
power supply 1.8/2.5,3.3 V 1.8/2.5,3.3 V 1.8/2.5,3.3 V 1.8/2.5,3.3 V 1.8/2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
speed 266 MHz 266 MHz 500 MHz 266 MHz 266 MHz
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Terminal surface MATTE TIN MATTE TIN Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker NXP NXP NXP - -
Base Number Matches - - 1 1 1
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