IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
Reach Compliance Code | unknown |
bit size | 32 |
JESD-30 code | S-PBGA-B740 |
JESD-609 code | e3 |
Humidity sensitivity level | 3 |
Number of terminals | 740 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA740,37X37,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 1.8/2.5,3.3 V |
Certification status | Not Qualified |
speed | 266 MHz |
surface mount | YES |
technology | CMOS |
Terminal surface | MATTE TIN |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
MPC8360EVVADDHA | MPC8360VVADDHA | MPC8360ZUAHFHA | MPC8360EZUADDHA | MPC8360ZUADDHA | |
---|---|---|---|---|---|
Description | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC |
Is it lead-free? | Lead free | Lead free | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | conform to | conform to | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | not_compliant | not_compliant | not_compliant |
bit size | 32 | 32 | 32 | 32 | 32 |
JESD-30 code | S-PBGA-B740 | S-PBGA-B740 | S-PBGA-B740 | S-PBGA-B740 | S-PBGA-B740 |
JESD-609 code | e3 | e3 | e0 | e0 | e0 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 |
Number of terminals | 740 | 740 | 740 | 740 | 740 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA |
Encapsulate equivalent code | BGA740,37X37,40 | BGA740,37X37,40 | BGA740,37X37,40 | BGA740,37X37,40 | BGA740,37X37,40 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 |
power supply | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V | 1.8/2.5,3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
speed | 266 MHz | 266 MHz | 500 MHz | 266 MHz | 266 MHz |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal surface | MATTE TIN | MATTE TIN | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Lead/Silver (Sn/Pb/Ag) |
Terminal form | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
Maker | NXP | NXP | NXP | - | - |
Base Number Matches | - | - | 1 | 1 | 1 |