MPC8360ZUAHFHA datasheet, PDF - EEWORLD Datasheet

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MPC8360ZUAHFHA: DescriptionIC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，112 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MPC8360ZUAHFHA Overview

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC

MPC8360ZUAHFHA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	NXP
Reach Compliance Code	not_compliant
bit size	32
JESD-30 code	S-PBGA-B740
JESD-609 code	e0
Humidity sensitivity level	3
Number of terminals	740
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA740,37X37,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	1.8/2.5,3.3 V
Certification status	Not Qualified
speed	500 MHz
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

MPC8360ZUAHFHA Related Products

	MPC8360ZUAHFHA	MPC8360EVVADDHA	MPC8360VVADDHA	MPC8360EZUADDHA	MPC8360ZUADDHA
Description	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC	IC,MICROPROCESSOR,32-BIT,CMOS,BGA,740PIN,PLASTIC
Is it lead-free?	Contains lead	Lead free	Lead free	Contains lead	Contains lead
Is it Rohs certified?	incompatible	conform to	conform to	incompatible	incompatible
Reach Compliance Code	not_compliant	unknown	unknown	not_compliant	not_compliant
bit size	32	32	32	32	32
JESD-30 code	S-PBGA-B740	S-PBGA-B740	S-PBGA-B740	S-PBGA-B740	S-PBGA-B740
JESD-609 code	e0	e3	e3	e0	e0
Humidity sensitivity level	3	3	3	3	3
Number of terminals	740	740	740	740	740
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA740,37X37,40	BGA740,37X37,40	BGA740,37X37,40	BGA740,37X37,40	BGA740,37X37,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	225	225	225	225
power supply	1.8/2.5,3.3 V	1.8/2.5,3.3 V	1.8/2.5,3.3 V	1.8/2.5,3.3 V	1.8/2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	500 MHz	266 MHz	266 MHz	266 MHz	266 MHz
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	Tin/Lead/Silver (Sn/Pb/Ag)	MATTE TIN	MATTE TIN	Tin/Lead/Silver (Sn/Pb/Ag)	Tin/Lead/Silver (Sn/Pb/Ag)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maker	NXP	NXP	NXP	-	-
Base Number Matches	1	-	-	1	1

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