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JM38510/33004B2A

Description
F/FAST SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20
Categorylogic    logic   
File Size51KB,3 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

JM38510/33004B2A Overview

F/FAST SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20

JM38510/33004B2A Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeQLCC
package instructionQCCN,
Contacts20
Reach Compliance Codeunknown
Is SamacsysN
seriesF/FAST
JESD-30 codeS-CQCC-N20
length8.885 mm
Logic integrated circuit typeNAND GATE
Number of functions2
Number of entries4
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeSQUARE
Package formCHIP CARRIER
propagation delay (tpd)6.5 ns
Certification statusNot Qualified
Maximum seat height1.9 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width8.885 mm
Base Number Matches1

JM38510/33004B2A Related Products

JM38510/33004B2A JM38510/33004BCA JM38510/33004BDA
Description F/FAST SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 NAND Gate, F/FAST Series, 2-Func, 4-Input, TTL, CDIP14, CERDIP-14 NAND Gate, F/FAST Series, 2-Func, 4-Input, TTL, CDFP14, CERAMIC, FP-14
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
package instruction QCCN, DIP, DFP,
Reach Compliance Code unknown unknown unknown
series F/FAST F/FAST F/FAST
JESD-30 code S-CQCC-N20 R-GDIP-T14 R-GDFP-F14
length 8.885 mm 19.495 mm 9.65 mm
Logic integrated circuit type NAND GATE NAND GATE NAND GATE
Number of functions 2 2 2
Number of entries 4 4 4
Number of terminals 20 14 14
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code QCCN DIP DFP
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE FLATPACK
propagation delay (tpd) 6.5 ns 6.5 ns 6.5 ns
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.9 mm 5.08 mm 2.15 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES NO YES
technology TTL TTL TTL
Temperature level MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL DUAL
width 8.885 mm 7.62 mm 6.415 mm
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