NAND Gate, F/FAST Series, 2-Func, 4-Input, TTL, CDFP14, CERAMIC, FP-14
Parameter Name | Attribute value |
Maker | Motorola ( NXP ) |
package instruction | DFP, |
Reach Compliance Code | unknown |
series | F/FAST |
JESD-30 code | R-GDFP-F14 |
length | 9.65 mm |
Logic integrated circuit type | NAND GATE |
Number of functions | 2 |
Number of entries | 4 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DFP |
Package shape | RECTANGULAR |
Package form | FLATPACK |
propagation delay (tpd) | 6.5 ns |
Certification status | Not Qualified |
Maximum seat height | 2.15 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 6.415 mm |
JM38510/33004BDA | JM38510/33004B2A | JM38510/33004BCA | |
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Description | NAND Gate, F/FAST Series, 2-Func, 4-Input, TTL, CDFP14, CERAMIC, FP-14 | F/FAST SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | NAND Gate, F/FAST Series, 2-Func, 4-Input, TTL, CDIP14, CERDIP-14 |
Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
package instruction | DFP, | QCCN, | DIP, |
Reach Compliance Code | unknown | unknown | unknown |
series | F/FAST | F/FAST | F/FAST |
JESD-30 code | R-GDFP-F14 | S-CQCC-N20 | R-GDIP-T14 |
length | 9.65 mm | 8.885 mm | 19.495 mm |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE |
Number of functions | 2 | 2 | 2 |
Number of entries | 4 | 4 | 4 |
Number of terminals | 14 | 20 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
encapsulated code | DFP | QCCN | DIP |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | FLATPACK | CHIP CARRIER | IN-LINE |
propagation delay (tpd) | 6.5 ns | 6.5 ns | 6.5 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.15 mm | 1.9 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO |
technology | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal form | FLAT | NO LEAD | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | QUAD | DUAL |
width | 6.415 mm | 8.885 mm | 7.62 mm |