|
74LVT74PW |
74LVT74DB |
74LVT74D |
Description |
D Flip-Flop, 2-Func, Positive Edge Triggered, BICMOS, PDSO14, |
D Flip-Flop, 2-Func, Positive Edge Triggered, BICMOS, PDSO14, |
D Flip-Flop, 2-Func, Positive Edge Triggered, BICMOS, PDSO14, |
Is it Rohs certified? |
conform to |
conform to |
conform to |
Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction |
TSSOP, TSSOP14,.25 |
SSOP, SSOP14,.3 |
SOP, SOP14,.25 |
Reach Compliance Code |
unknown |
unknown |
unknown |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
Maximum Frequency@Nom-Sup |
150000000 Hz |
150000000 Hz |
150000000 Hz |
MaximumI(ol) |
0.032 A |
0.032 A |
0.032 A |
Humidity sensitivity level |
1 |
1 |
1 |
Number of functions |
2 |
2 |
2 |
Number of terminals |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SSOP |
SOP |
Encapsulate equivalent code |
TSSOP14,.25 |
SSOP14,.3 |
SOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE |
power supply |
3.3 V |
3.3 V |
3.3 V |
Prop。Delay @ Nom-Sup |
5 ns |
5 ns |
5 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
technology |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.635 mm |
0.635 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Trigger type |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
Base Number Matches |
1 |
1 |
1 |