Inverter, TTL, PDIP14
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T14 |
JESD-609 code | e0 |
Logic integrated circuit type | INVERTER |
MaximumI(ol) | 0.04 A |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | OPEN-COLLECTOR |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 51 mA |
Prop。Delay @ Nom-Sup | 23 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
N7406N | N7406D | N7406D-T | N7407N | N7407D | N7407D-T | |
---|---|---|---|---|---|---|
Description | Inverter, TTL, PDIP14 | Inverter, TTL, PDSO14 | Inverter, TTL, PDSO14 | Buffer, TTL, PDIP14 | Buffer, TTL, PDSO14 | Buffer, TTL, PDSO14 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | INVERTER | INVERTER | INVERTER | BUFFER | BUFFER | BUFFER |
MaximumI(ol) | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Output characteristics | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP | SOP | SOP |
Encapsulate equivalent code | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | SOP14,.25 | SOP14,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 51 mA | 51 mA | 51 mA | 41 mA | 51 mA | 51 mA |
Prop。Delay @ Nom-Sup | 23 ns | 23 ns | 23 ns | 30 ns | 30 ns | 30 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO | NO | NO | NO |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO | YES | YES |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |