N74F157DB datasheet, PDF - EEWORLD Datasheet

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N74F157DB: DescriptionMultiplexer, 4-Func, 2 Line Input, TTL, PDSO16; Categorylogic logic; File Size747KB，9 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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N74F157DB Overview

Multiplexer, 4-Func, 2 Line Input, TTL, PDSO16

N74F157DB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	SOP, SOP16,.25
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Logic integrated circuit type	MULTIPLEXER
Number of functions	4
Number of entries	2
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Prop。Delay @ Nom-Sup	15 ns
surface mount	YES
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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N74F157DB Related Products

	N74F157DB	S54F157G/883B	S54F157G/883C	S54F157F/883B	N74F158DB
Description	Multiplexer, 4-Func, 2 Line Input, TTL, PDSO16	Multiplexer, 4-Func, 2 Line Input, TTL, CQCC20	Multiplexer, 4-Func, 2 Line Input, TTL, CQCC20	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16	Multiplexer, 4-Func, 2 Line Input, TTL, PDSO16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G16	S-XQCC-N20	S-XQCC-N20	R-XDIP-T16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
Number of functions	4	4	4	4	4
Number of entries	2	2	2	2	2
Number of terminals	16	20	20	16	16
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	SOP	QCCN	QCCN	DIP	SOP
Encapsulate equivalent code	SOP16,.25	LCC20,.35SQ	LCC20,.35SQ	DIP16,.3	SOP16,.25
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	SMALL OUTLINE
Prop。Delay @ Nom-Sup	15 ns	17 ns	17 ns	17 ns	10.5 ns
surface mount	YES	YES	YES	NO	YES
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	NO LEAD	NO LEAD	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL
Base Number Matches	1	1	1	1	1
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-
package instruction	SOP, SOP16,.25	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	-	SOP, SOP16,.25
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-
Filter level	-	MIL-STD-883 Class B (Modified)	MIL-STD-883 Class C	MIL-STD-883 Class B (Modified)	-

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