FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | TEMIC |
| package instruction | 0.600 INCH, CERAMIC, DIP-28 |
| Reach Compliance Code | unknown |
| Maximum access time | 65 ns |
| Maximum clock frequency (fCLK) | 12.5 MHz |
| period time | 80 ns |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| memory density | 18432 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2KX9 |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.00006 A |
| Maximum slew rate | 0.07 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
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