ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | ALSC [Alliance Semiconductor Corporation] |
Parts packaging code | QFP |
package instruction | LQFP, QFP100,.63X.87 |
Contacts | 100 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 8.5 ns |
Other features | FLOW-THROUGH ARCHITECTURE |
Maximum clock frequency (fCLK) | 100 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e3 |
length | 20 mm |
memory density | 18874368 bit |
Memory IC Type | ZBT SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1MX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 2.5/3.3,3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.04 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.25 mA |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 14 mm |
Base Number Matches | 1 |
AS7C331MNTF18A-85TQIN | AS7C331MNTF18A-10TQCN | AS7C331MNTF18A-75TQIN | AS7C331MNTF18A-85TQC | AS7C331MNTF18A-10TQC | AS7C331MNTF18A-75TQC | AS7C331MNTF18A-75TQI | |
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Description | ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | ZBT SRAM, 1MX18, 10ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | ZBT SRAM, 1MX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 | ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 1MX18, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 1MX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | ZBT SRAM, 1MX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 |
Is it Rohs certified? | conform to | conform to | conform to | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
package instruction | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, | LQFP, |
Contacts | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 8.5 ns | 10 ns | 7.5 ns | 8.5 ns | 10 ns | 7.5 ns | 7.5 ns |
Other features | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e3 | e3 | e3 | e0 | e0 | e0 | e0 |
length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit |
Memory IC Type | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
memory width | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
organize | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 245 | 245 | 245 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | MATTE TIN | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maximum clock frequency (fCLK) | 100 MHz | 83 MHz | - | 100 MHz | 83 MHz | - | - |
I/O type | COMMON | COMMON | - | COMMON | COMMON | - | - |
Output characteristics | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | - |
Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.63X.87 | - | QFP100,.63X.87 | QFP100,.63X.87 | - | - |
power supply | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | - | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | - | - |
Maximum standby current | 0.04 A | 0.04 A | - | 0.04 A | 0.04 A | - | - |
Minimum standby current | 3.14 V | 3.14 V | - | 3.14 V | 3.14 V | - | - |
Maximum slew rate | 0.25 mA | 0.23 mA | - | 0.25 mA | 0.23 mA | - | - |