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AS7C331MNTF18A-85TQIN

Description
ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100
Categorystorage    storage   
File Size407KB,18 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Environmental Compliance
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AS7C331MNTF18A-85TQIN Overview

ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100

AS7C331MNTF18A-85TQIN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time8.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals100
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)245
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.04 A
Minimum standby current3.14 V
Maximum slew rate0.25 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm
Base Number Matches1

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Description ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 ZBT SRAM, 1MX18, 10ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 ZBT SRAM, 1MX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100 ZBT SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 ZBT SRAM, 1MX18, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 ZBT SRAM, 1MX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 ZBT SRAM, 1MX18, 7.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Is it Rohs certified? conform to conform to conform to incompatible incompatible incompatible incompatible
Parts packaging code QFP QFP QFP QFP QFP QFP QFP
package instruction LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, LQFP,
Contacts 100 100 100 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 8.5 ns 10 ns 7.5 ns 8.5 ns 10 ns 7.5 ns 7.5 ns
Other features FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e3 e3 e3 e0 e0 e0 e0
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 18 18 18 18 18 18
Number of functions 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C
organize 1MX18 1MX18 1MX18 1MX18 1MX18 1MX18 1MX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP LQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 245 245 245 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface MATTE TIN MATTE TIN MATTE TIN Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1 1 1 1
Maximum clock frequency (fCLK) 100 MHz 83 MHz - 100 MHz 83 MHz - -
I/O type COMMON COMMON - COMMON COMMON - -
Output characteristics 3-STATE 3-STATE - 3-STATE 3-STATE - -
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 - QFP100,.63X.87 QFP100,.63X.87 - -
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V - 2.5/3.3,3.3 V 2.5/3.3,3.3 V - -
Maximum standby current 0.04 A 0.04 A - 0.04 A 0.04 A - -
Minimum standby current 3.14 V 3.14 V - 3.14 V 3.14 V - -
Maximum slew rate 0.25 mA 0.23 mA - 0.25 mA 0.23 mA - -

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