SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MH1608□□□□2□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A
B
B
C
D
D
:
:
:
:
1.60±0.15
0.80±0.15
0.80±0.15
0.40±0.20
m/m
m/m
m/m
m/m
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒FEATURES：
a﹒Monolithic structure ensuring high performance and reliability.
b﹒High frequency applications up to 6GHz.
c﹒Terminal：Ag/Cu/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS：
a﹒RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
50sec max.
230
℃
Ⅴ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-55℃---- +125℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Solderability：Preheat 150℃. 60 sec
Solder：H63A
Solder temp.：230±5℃
Flux：Rosin
Dip time：4±1 sec
Temperature (
℃
)
C
250
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
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