ST95080B3 datasheet, PDF - EEWORLD Datasheet

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ST95080B3: Description1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8; Categorystorage storage; File Size532KB，17 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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ST95080B3 Overview

1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8

ST95080B3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	not_compliant
ECCN code	EAR99
Other features	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	10
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.55 mm
memory density	8192 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	1KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.9 mm
Serial bus type	SPI
Maximum standby current	0.00005 A
Maximum slew rate	0.002 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

ST95080B3 Related Products

	ST95080B3	ST95080B6	ST95080M6TR	ST95080M3TR	ST95080B1	ST95080M1	ST95080M3	ST95080M6	ST95080M1TR
Description	1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8	1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8	1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8	1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8	1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8	IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC	IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC	IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC	1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8
Reach Compliance Code	not_compliant	not_compliant	unknown	unknown	not_compliant	not_compliant	not_compliant	not_compliant	unknow
Data retention time - minimum	10	10	10	10	10	10	10	10	10
JESD-30 code	R-PDIP-T8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8	8
Number of terminals	8	8	8	8	8	8	8	8	8
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000	1000
Maximum operating temperature	125 °C	85 °C	85 °C	125 °C	70 °C	70 °C	125 °C	85 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-40 °C	-40 °C	-
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP	DIP	SOP	SOP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	COMMERCIAL	COMMERCIAL	AUTOMOTIVE	INDUSTRIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Is it Rohs certified?	incompatible	incompatible	-	-	incompatible	incompatible	incompatible	incompatible	-
Parts packaging code	DIP	DIP	SOIC	SOIC	DIP	-	-	-	SOIC
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	SOP,	SOP,	DIP, DIP8,.3	-	-	-	SOP,
Contacts	8	8	8	8	8	-	-	-	8
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	-	-	-	EAR99
Other features	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE	-	-	-	100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE
Maximum clock frequency (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	-	-	-	2 MHz
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-	-	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-
JESD-609 code	e0	e0	-	-	e0	e0	e0	e0	-
length	9.55 mm	9.55 mm	4.9 mm	4.9 mm	9.55 mm	-	-	-	4.9 mm
Number of functions	1	1	1	1	1	-	-	-	1
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	-	-	SYNCHRONOUS
Encapsulate equivalent code	DIP8,.3	DIP8,.3	-	-	DIP8,.3	SOP8,.25	SOP8,.25	SOP8,.25	-
power supply	5 V	5 V	-	-	5 V	5 V	5 V	5 V	-
Maximum seat height	5.9 mm	5.9 mm	1.75 mm	1.75 mm	5.9 mm	-	-	-	1.75 mm
Maximum standby current	0.00005 A	0.00005 A	-	-	0.00005 A	0.00005 A	0.00005 A	0.00005 A	-
Maximum slew rate	0.002 mA	0.002 mA	-	-	0.002 mA	0.002 mA	0.002 mA	0.002 mA	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-	-	-	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-	-	-	4.5 V
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
width	7.62 mm	7.62 mm	3.9 mm	3.9 mm	7.62 mm	-	-	-	3.9 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	-	-	-	10 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-
Maker	-	-	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics

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